Qi Zhang

Person

Wellesley, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper-alloy capping layers for metallization in touch-panel displays
- Patent number 11,640,222
- Issue date May 2, 2023
- Materion Newton, Inc.
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Copper-alloy capping layers for metallization in touch-panel displays
- Patent number 11,392,257
- Issue date Jul 19, 2022
- MATERION NEWTON INC.
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sputtering targets and devices including Mo, Nb, and Ta, and methods
- Patent number 11,306,388
- Issue date Apr 19, 2022
- H.C. Starck Inc.
- Shuwei Sun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thin-film transistor and method of forming an electrode of a thin-f...
- Patent number 10,916,569
- Issue date Feb 9, 2021
- H.C. Starck Inc.
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Copper-alloy capping layers for metallization in touch-panel displays
- Patent number 9,929,187
- Issue date Mar 27, 2018
- H.C. Starck Inc.
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Copper-alloy barrier layers for metallization in thin-film transist...
- Patent number 9,299,472
- Issue date Mar 29, 2016
- H.C. Starck Inc.
- Shuwei Sun
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
- Publication number 20220308705
- Publication date Sep 29, 2022
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SPUTTERING TARGETS AND DEVICES INCLUDING MO, NB, AND TA, AND METHODS
- Publication number 20220220603
- Publication date Jul 14, 2022
- H.C. Starck Inc.
- Shuwei Sun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
- Publication number 20210208738
- Publication date Jul 8, 2021
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SPUTTERING TARGETS AND DEVICES INCLUDING Mo, Nb, and Ta, AND METHODS
- Publication number 20190066987
- Publication date Feb 28, 2019
- H.C. Starck Inc.
- Shuwei Sun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
- Publication number 20180175075
- Publication date Jun 21, 2018
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SPUTTERING TARGETS AND DEVICES INCLUDING Mo, Nb, and Ta, AND METHODS
- Publication number 20160203960
- Publication date Jul 14, 2016
- H.C. Starck Inc.
- Shuwei Sun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER-ALLOY BARRIER LAYERS FOR METALLIZATION IN THIN-FILM TRANSIST...
- Publication number 20160172386
- Publication date Jun 16, 2016
- Shuwei Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
- Publication number 20140362307
- Publication date Dec 11, 2014
- Shuwei Sun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COPPER-ALLOY BARRIER LAYERS FOR METALLIZATION IN THIN-FILM TRANSIST...
- Publication number 20140363933
- Publication date Dec 11, 2014
- Shuwei Sun
- G06 - COMPUTING CALCULATING COUNTING

Person

Patents Grantslast 30 patents

Copper-alloy capping layers for metallization in touch-panel displays

Copper-alloy capping layers for metallization in touch-panel displays

Sputtering targets and devices including Mo, Nb, and Ta, and methods

Thin-film transistor and method of forming an electrode of a thin-f...

Copper-alloy capping layers for metallization in touch-panel displays

Copper-alloy barrier layers for metallization in thin-film transist...

Patents Applicationslast 30 patents

COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS

SPUTTERING TARGETS AND DEVICES INCLUDING MO, NB, AND TA, AND METHODS

COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS

SPUTTERING TARGETS AND DEVICES INCLUDING Mo, Nb, and Ta, AND METHODS

COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS

SPUTTERING TARGETS AND DEVICES INCLUDING Mo, Nb, and Ta, AND METHODS

COPPER-ALLOY BARRIER LAYERS FOR METALLIZATION IN THIN-FILM TRANSIST...

COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS

COPPER-ALLOY BARRIER LAYERS FOR METALLIZATION IN THIN-FILM TRANSIST...