Qian Wang

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Yongin-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Wafer level packaging cap and fabrication method thereof
- Patent number 7,579,685
- Issue date Aug 25, 2009
- Samsung Electronics Co., Ltd.
- Moon-chul Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cap for semiconductor device package, and manufacturing method thereof
- Patent number 7,510,968
- Issue date Mar 31, 2009
- Samsung Electronics Co., Ltd.
- Moon-chul Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Cap for semiconductor device package, and manufacturing method thereof
- Publication number 20060286798
- Publication date Dec 21, 2006
- SAMSUNG ELECTRONICS CO., LTD.
- Moon-chul Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level packaging cap and fabrication method thereof
- Publication number 20060175707
- Publication date Aug 10, 2006
- SAMSUNG ELECTRONICS CO., LTD.
- Moon-chul Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY