QIANWEN CHEN

Person

Ossining, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-sensor platform for health monitoring
- Patent number 12,014,816
- Issue date Jun 18, 2024
- International Business Machines Corporation
- John Knickerbocker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Silicon handler with laser-release layers
- Patent number 11,908,723
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film battery stacking
- Patent number 11,876,233
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision thin electronics handling integration
- Patent number 11,710,669
- Issue date Jul 25, 2023
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized electronics package with patterned thin film solid sta...
- Patent number 11,539,081
- Issue date Dec 27, 2022
- International Business Machines Corporation
- Qianwen Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Miniaturized electronics package with patterned thin film solid sta...
- Patent number 11,539,080
- Issue date Dec 27, 2022
- International Business Machines Corporation
- Qianwen Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Hermetic packaging of a micro-battery device
- Patent number 11,522,243
- Issue date Dec 6, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible silicon nanowire electrode
- Patent number 11,311,224
- Issue date Apr 26, 2022
- International Business Machines Corporation
- Qianwen Chen
- B82 - NANO-TECHNOLOGY
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 11,222,862
- Issue date Jan 11, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film solid-state microbattery packaging
- Patent number 11,171,374
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap metal tip electrostatic discharge protection
- Patent number 11,165,248
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap metal tip electrostatic discharge protection
- Patent number 11,133,670
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Machine learning based airflow sensing for aircraft
- Patent number 11,119,504
- Issue date Sep 14, 2021
- International Business Machines Corporation
- Wang Zhou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thin film battery packaging
- Patent number 11,101,513
- Issue date Aug 24, 2021
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics miniaturization platform for medication verification an...
- Patent number 11,094,407
- Issue date Aug 17, 2021
- International Business Machines Corporation
- John Knickerbocker
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Flexible silicon nanowire electrode
- Patent number 11,058,337
- Issue date Jul 13, 2021
- International Business Machines Corporation
- Qianwen Chen
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Heterogeneous miniaturization platform
- Patent number 11,055,459
- Issue date Jul 6, 2021
- International Business Machines Corporation
- Qianwen Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hermetial via seal for thin film battery
- Patent number 10,964,925
- Issue date Mar 30, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film solid-state microbattery packaging
- Patent number 10,833,296
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around transistor based non-volatile memory devices
- Patent number 10,784,380
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Zheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a plurality of electro-optical module assemblies
- Patent number 10,687,425
- Issue date Jun 16, 2020
- International Business Machines Corporation
- Paul S. Andry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated electro-optical module assembly
- Patent number 10,670,656
- Issue date Jun 2, 2020
- International Business Machines Corporation
- Paul S. Andry
- G01 - MEASURING TESTING
Information Patent Grant
Reconfigurable allocation of VNCAP inter-layer vias for co-tuning o...
- Patent number 10,658,973
- Issue date May 19, 2020
- International Business Machines Corporation
- Zheng Xu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip handling and electronic component integration
- Patent number 10,658,182
- Issue date May 19, 2020
- International Business Machines Corporation
- Russell A. Budd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized electronics package with patterned thin film solid sta...
- Patent number 10,651,507
- Issue date May 12, 2020
- International Business Machines Corporation
- Qianwen Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Chip handling and electronic component integration
- Patent number 10,651,036
- Issue date May 12, 2020
- International Business Machines Corporation
- Russell A. Budd
- B24 - GRINDING POLISHING
Information Patent Grant
Method of forming a plurality of electro-optical module assemblies
- Patent number 10,638,613
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Paul S. Andry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Miniaturized electronics package with patterned thin film solid sta...
- Patent number 10,637,101
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Qianwen Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Flexible silicon nanowire electrode
- Patent number 10,610,117
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Qianwen Chen
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Gate-all-around transistor based non-volatile memory devices
- Patent number 10,586,875
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Zheng Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INFRARED DEBOND DAMAGE MITIGATION BY COPPER FILL PATTERN
- Publication number 20240170288
- Publication date May 23, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON HANDLER WITH LASER-RELEASE LAYERS
- Publication number 20230178404
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER WAFER WITH MULTIPLE ANTIREFLECTIVE COATING LAYERS
- Publication number 20230087366
- Publication date Mar 23, 2023
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Sensor Platform for Health Monitoring
- Publication number 20220199235
- Publication date Jun 23, 2022
- International Business Machines Corporation
- John Knickerbocker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HERMETIC PACKAGING OF A MICRO-BATTERY DEVICE
- Publication number 20220200086
- Publication date Jun 23, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECISION THIN ELECTRONICS HANDLING INTEGRATION
- Publication number 20210366789
- Publication date Nov 25, 2021
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM BATTERY STACKING
- Publication number 20210265606
- Publication date Aug 26, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronics Miniaturization Platform for Medication Verification an...
- Publication number 20200395115
- Publication date Dec 17, 2020
- International Business Machines Corporation
- John Knickerbocker
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
HERMETIAL VIA SEAL FOR THIN FILM BATTERY
- Publication number 20200274113
- Publication date Aug 27, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIATURIZED ELECTRONICS PACKAGE WITH PATTERNED THIN FILM SOLID STA...
- Publication number 20200194841
- Publication date Jun 18, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIATURIZED ELECTRONICS PACKAGE WITH PATTERNED THIN FILM SOLID STA...
- Publication number 20200185781
- Publication date Jun 11, 2020
- International Business Machines Corporation
- Qianwen Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MACHINE LEARNING BASED AIRFLOW SENSING FOR AIRCRAFT
- Publication number 20200151553
- Publication date May 14, 2020
- International Business Machines Corporation
- Wang Zhou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE SILICON NANOWIRE ELECTRODE
- Publication number 20200146576
- Publication date May 14, 2020
- International Business Machines Corporation
- Qianwen Chen
- B82 - NANO-TECHNOLOGY
Information Patent Application
GATE-ALL-AROUND TRANSISTOR BASED NON-VOLATILE MEMORY DEVICES
- Publication number 20200083382
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Zheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM BATTERY PACKAGING
- Publication number 20200075906
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP METAL TIP ELECTROSTATIC DISCHARGE PROTECTION
- Publication number 20200059090
- Publication date Feb 20, 2020
- International Business Machines Corporation
- Qianwen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIR GAP METAL TIP ELECTROSTATIC DISCHARGE PROTECTION
- Publication number 20200059091
- Publication date Feb 20, 2020
- International Business Machines Corporation
- Qianwen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20200051948
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND TRANSISTOR BASED NON-VOLATILE MEMORY DEVICES
- Publication number 20200013896
- Publication date Jan 9, 2020
- International Business Machines Corporation
- Zheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP HANDLING AND ELECTRONIC COMPONENT INTEGRATION
- Publication number 20190378720
- Publication date Dec 12, 2019
- International Business Machines Corporation
- Russell A. Budd
- B24 - GRINDING POLISHING
Information Patent Application
CHIP HANDLING AND ELECTRONIC COMPONENT INTEGRATION
- Publication number 20190378719
- Publication date Dec 12, 2019
- International Business Machines Corporation
- Russell A. Budd
- B24 - GRINDING POLISHING
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20190348392
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reconfigurable Allocation of VNCAP Inter-layer Vias for Co-Tuning o...
- Publication number 20190334477
- Publication date Oct 31, 2019
- International Business Machines Corporation
- Zheng Xu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING
- Publication number 20190326190
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS MINIATURIZATION PLATFORM
- Publication number 20190311082
- Publication date Oct 10, 2019
- International Business Machines Corporation
- Qianwen Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THIN FILM SOLID-STATE MICROBATTERY PACKAGING
- Publication number 20190097182
- Publication date Mar 28, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM SOLID-STATE MICROBATTERY PACKAGING
- Publication number 20190097183
- Publication date Mar 28, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP HANDLING AND ELECTRONIC COMPONENT INTEGRATION
- Publication number 20190088481
- Publication date Mar 21, 2019
- International Business Machines Corporation
- Russell A. Budd
- B24 - GRINDING POLISHING
Information Patent Application
CHIP HANDLING AND ELECTRONIC COMPONENT INTEGRATION
- Publication number 20190088480
- Publication date Mar 21, 2019
- International Business Machines Corporation
- Russell A. Budd
- B24 - GRINDING POLISHING
Information Patent Application
MICRO-BATTERY USING GLASS PACKAGE
- Publication number 20180375067
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS

QIANWEN CHEN

Person

Patents Grantslast 30 patents

Multi-sensor platform for health monitoring

Silicon handler with laser-release layers

Thin film battery stacking

Precision thin electronics handling integration

Miniaturized electronics package with patterned thin film solid sta...

Miniaturized electronics package with patterned thin film solid sta...

Hermetic packaging of a micro-battery device

Flexible silicon nanowire electrode

High speed handling of ultra-small chips by selective laser bonding...

Thin film solid-state microbattery packaging

Air gap metal tip electrostatic discharge protection

Air gap metal tip electrostatic discharge protection

Machine learning based airflow sensing for aircraft

Thin film battery packaging

Electronics miniaturization platform for medication verification an...

Flexible silicon nanowire electrode

Heterogeneous miniaturization platform

Hermetial via seal for thin film battery

Thin film solid-state microbattery packaging

Gate-all-around transistor based non-volatile memory devices

Method of forming a plurality of electro-optical module assemblies

Integrated electro-optical module assembly

Reconfigurable allocation of VNCAP inter-layer vias for co-tuning o...

Chip handling and electronic component integration

Miniaturized electronics package with patterned thin film solid sta...

Chip handling and electronic component integration

Method of forming a plurality of electro-optical module assemblies

Miniaturized electronics package with patterned thin film solid sta...

Flexible silicon nanowire electrode

Gate-all-around transistor based non-volatile memory devices

Patents Applicationslast 30 patents

INFRARED DEBOND DAMAGE MITIGATION BY COPPER FILL PATTERN

SILICON HANDLER WITH LASER-RELEASE LAYERS

CARRIER WAFER WITH MULTIPLE ANTIREFLECTIVE COATING LAYERS

Multi-Sensor Platform for Health Monitoring

HERMETIC PACKAGING OF A MICRO-BATTERY DEVICE

PRECISION THIN ELECTRONICS HANDLING INTEGRATION

THIN FILM BATTERY STACKING

Electronics Miniaturization Platform for Medication Verification an...

HERMETIAL VIA SEAL FOR THIN FILM BATTERY

MINIATURIZED ELECTRONICS PACKAGE WITH PATTERNED THIN FILM SOLID STA...

MINIATURIZED ELECTRONICS PACKAGE WITH PATTERNED THIN FILM SOLID STA...

MACHINE LEARNING BASED AIRFLOW SENSING FOR AIRCRAFT

FLEXIBLE SILICON NANOWIRE ELECTRODE

GATE-ALL-AROUND TRANSISTOR BASED NON-VOLATILE MEMORY DEVICES

THIN FILM BATTERY PACKAGING

AIR GAP METAL TIP ELECTROSTATIC DISCHARGE PROTECTION

AIR GAP METAL TIP ELECTROSTATIC DISCHARGE PROTECTION

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

GATE-ALL-AROUND TRANSISTOR BASED NON-VOLATILE MEMORY DEVICES

CHIP HANDLING AND ELECTRONIC COMPONENT INTEGRATION

CHIP HANDLING AND ELECTRONIC COMPONENT INTEGRATION

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

Reconfigurable Allocation of VNCAP Inter-layer Vias for Co-Tuning o...

WAFER STACKING FOR INTEGRATED CIRCUIT MANUFACTURING

HETEROGENEOUS MINIATURIZATION PLATFORM

THIN FILM SOLID-STATE MICROBATTERY PACKAGING

THIN FILM SOLID-STATE MICROBATTERY PACKAGING

CHIP HANDLING AND ELECTRONIC COMPONENT INTEGRATION

CHIP HANDLING AND ELECTRONIC COMPONENT INTEGRATION

MICRO-BATTERY USING GLASS PACKAGE