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QIFENG WANG

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Patents Grantslast 30 patents

  • Information Patent Grant

    Chip packaging structures
    • Patent number 9,698,113
    • Issue date Jul 4, 2017
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Qifeng Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip packaging structures and treatment methods thereof
    • Patent number 9,431,215
    • Issue date Aug 30, 2016
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Qifeng Wang
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    CHIP PACKAGING STRUCTURES
    • Publication number 20160336285
    • Publication date Nov 17, 2016
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • QIFENG WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGING STRUCTURES AND TREATMENT METHODS THEREOF
    • Publication number 20150325544
    • Publication date Nov 12, 2015
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • QIFENG WANG
    • H01 - BASIC ELECTRIC ELEMENTS