TREA

Qing Chun He

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  • Tianjin, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Coated lead frame
    • Patent number 7,887,928
    • Issue date Feb 15, 2011
    • FREESCALE SEMICONDUCTOR, INC.
    • Chao Wang
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Flipchip QFN package
    • Patent number 7,112,871
    • Issue date Sep 26, 2006
    • FREESCALE SEMICONDUCTOR, INC.
    • Hei Ming Shiu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Flipchip QFN package and method therefor
    • Patent number 6,867,072
    • Issue date Mar 15, 2005
    • FREESCALE SEMICONDUCTOR, INC.
    • Hei Ming Shiu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    COATED LEAD FRAME
    • Publication number 20090111220
    • Publication date Apr 30, 2009
    • FREESCALE SEMICONDUCTOR, INC.
    • Chao Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Flipchip QFN package and method therefor
    • Publication number 20050156291
    • Publication date Jul 21, 2005
    • Hei Ming Shiu
    • H01 - BASIC ELECTRIC ELEMENTS