Qing Feng GUAN

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for bonding a plurality of dies to a carrier p...
- Patent number 12,183,620
- Issue date Dec 31, 2024
- PYXIS CF PTE. LTD.
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision reconstruction for panel-level packaging
- Patent number 11,817,326
- Issue date Nov 14, 2023
- PYXIS CF PTE. LTD.
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post bond inspection of devices for panel packaging
- Patent number 11,552,043
- Issue date Jan 10, 2023
- PYXIS CF PTE. LTD.
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR BONDING A PLURALITY OF DIES TO A CARRIER P...
- Publication number 20220102189
- Publication date Mar 31, 2022
- PYXIS CF PTE. LTD.
- HWEE SENG CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECISION RECONSTRUCTION FOR PANEL-LEVEL PACKAGING
- Publication number 20220028703
- Publication date Jan 27, 2022
- PYXIS CF PTE. LTD.
- Amlan SEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST BOND INSPECTION OF DEVICES FOR PANEL PACKAGING
- Publication number 20210118841
- Publication date Apr 22, 2021
- PYXIS CF PTE. LTD.
- Amlan SEN
- H01 - BASIC ELECTRIC ELEMENTS