Qing Gan

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Encapsulated MEMS device and method to form the same
- Patent number 8,349,635
- Issue date Jan 8, 2013
- Silicon Laboratories Inc.
- Qing Gan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for forming a through via
- Patent number 7,696,064
- Issue date Apr 13, 2010
- Skyworks Solutions, Inc.
- Qing Gan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating a wafer level package with device wafer and...
- Patent number 7,629,201
- Issue date Dec 8, 2009
- Skyworks Solutions, Inc.
- Qing Gan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package including a device wafer integrated with a pass...
- Patent number 7,576,426
- Issue date Aug 18, 2009
- Skyworks Solutions, Inc.
- Qing Gan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with silicon gasket
- Patent number 6,979,597
- Issue date Dec 27, 2005
- Agilent Technologies, Inc.
- Frank S Geefay
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sloped via contacts
- Patent number 6,903,012
- Issue date Jun 7, 2005
- Agilent Technologies, Inc.
- Frank S Geefay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with silicon gasket
- Patent number 6,787,897
- Issue date Sep 7, 2004
- Agilent Technologies, Inc.
- Frank S Geefay
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die singulation using deep silicon etching
- Patent number 6,777,267
- Issue date Aug 17, 2004
- Agilent Technologies, Inc.
- Richard C. Ruby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film deposition to enhance sealing yield of microcap wafer-level pa...
- Patent number 6,777,263
- Issue date Aug 17, 2004
- Agilent Technologies, Inc.
- Qing Gan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for hermeticity determination and leak detecti...
- Patent number 6,763,702
- Issue date Jul 20, 2004
- Agilent Technologies, Inc.
- Allen Chien
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Methods for Forming a Through Via
- Publication number 20090098731
- Publication date Apr 16, 2009
- Qing Gan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for fabricating a wafer level package having through wafer v...
- Publication number 20080064142
- Publication date Mar 13, 2008
- Skyworks Solutions, Inc.
- QING GAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for fabricating a wafer level package with device wafer and...
- Publication number 20080003761
- Publication date Jan 3, 2008
- Skyworks Solutions, Inc.
- Qing Gan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level package including a device wafer integrated with a pass...
- Publication number 20060220173
- Publication date Oct 5, 2006
- Skyworks Solutions, Inc.
- Qing Gan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for fabricating a wafer level package having through wafer v...
- Publication number 20060211233
- Publication date Sep 21, 2006
- Skyworks Solutions, Inc.
- Qing Gan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level chip scale hermetic package
- Publication number 20040259325
- Publication date Dec 23, 2004
- Qing Gan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sloped via contacts
- Publication number 20040198040
- Publication date Oct 7, 2004
- Frank S. Geefay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR HERMETICITY DETERMINATION AND LEAK DETECTI...
- Publication number 20040118187
- Publication date Jun 24, 2004
- Allen Chien
- G01 - MEASURING TESTING
Information Patent Application
Die singulation using deep silicon etching
- Publication number 20040087059
- Publication date May 6, 2004
- Richard C. Ruby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level package with silicon gasket
- Publication number 20040029360
- Publication date Feb 12, 2004
- Frank S. Geefay
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer-level package with silicon gasket
- Publication number 20030116825
- Publication date Jun 26, 2003
- Frank S. Geefay
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sloped via contacts
- Publication number 20030119308
- Publication date Jun 26, 2003
- Frank S. Geefay
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Encapsulated MEMS device and method to form the same

Methods for forming a through via

Method for fabricating a wafer level package with device wafer and...

Wafer level package including a device wafer integrated with a pass...

Wafer-level package with silicon gasket

Sloped via contacts

Wafer-level package with silicon gasket

Die singulation using deep silicon etching

Film deposition to enhance sealing yield of microcap wafer-level pa...

Method and apparatus for hermeticity determination and leak detecti...

Patents Applicationslast 30 patents

Methods for Forming a Through Via

Method for fabricating a wafer level package having through wafer v...

Method for fabricating a wafer level package with device wafer and...

Wafer level package including a device wafer integrated with a pass...

Method for fabricating a wafer level package having through wafer v...

Wafer level chip scale hermetic package

Sloped via contacts

METHOD AND APPARATUS FOR HERMETICITY DETERMINATION AND LEAK DETECTI...

Die singulation using deep silicon etching

Wafer-level package with silicon gasket

Wafer-level package with silicon gasket

Sloped via contacts