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Qing Ji
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El Monte, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method of fabricating a semiconductor package using a fluxing under...
Patent number
8,273,606
Issue date
Sep 25, 2012
Henkel Corporation
Chew B. Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low exothermic thermosetting resin compositions useful as underfill...
Patent number
8,075,721
Issue date
Dec 13, 2011
Henkel Corporation
Qing Ji
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interlayer dielectric and pre-applied die attach adhesive materials
Patent number
7,550,825
Issue date
Jun 23, 2009
Henkel Corporation
Benedicto delos Santos
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Interlayer dielectric and pre-applied die attach adhesive materials
Patent number
7,312,534
Issue date
Dec 25, 2007
Henkel Corporation
Benedicto delos Santos
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE USING A FLUXING UNDER...
Publication number
20110065242
Publication date
Mar 17, 2011
Chew B. Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BENZOXAZINE CONTAINING COMPOSITIONS OF MATTER AND CURABLE COMPOSITI...
Publication number
20100140542
Publication date
Jun 10, 2010
Henkel Corporation
Qing Ji
C07 - ORGANIC CHEMISTRY
Information
Patent Application
Low Exothermic Thermosetting Resin Compositions Useful As Underfill...
Publication number
20080285247
Publication date
Nov 20, 2008
Henkel Corporation
Qing Ji
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Epoxy-Based Compositions Having Improved Impact Resistance
Publication number
20080051524
Publication date
Feb 28, 2008
Henkel Corporation
Qing Ji
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Interlayer Dielectric and Pre-Applied Die Attach Adhesive Materials
Publication number
20070278683
Publication date
Dec 6, 2007
Henkel Corporation
Benedicto delos Santos
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...