Qing Ma

Person

Saratoga, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with air pressure sensor
- Patent number 10,508,961
- Issue date Dec 17, 2019
- Intel Corporation
- Kevin L. Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package MEMS switch and method
- Patent number 10,453,635
- Issue date Oct 22, 2019
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and compositions for activation of sirtuins with Annexin A1...
- Patent number 10,172,915
- Issue date Jan 8, 2019
- Duke University
- Zhiquan Zhang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method of making an accelerometer
- Patent number 10,156,583
- Issue date Dec 18, 2018
- Intel Corporation
- Qing Ma
- G01 - MEASURING TESTING
Information Patent Grant
Method of making glass core substrate for integrated circuit devices
- Patent number 10,070,524
- Issue date Sep 4, 2018
- Intel Corporation
- Qing Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic structures having laminated or embedded glass routi...
- Patent number 10,008,452
- Issue date Jun 26, 2018
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass clad microelectronic substrate
- Patent number 9,793,201
- Issue date Oct 17, 2017
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for integrated circuit devices including multi-layer glas...
- Patent number 9,761,514
- Issue date Sep 12, 2017
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package MEMS switch and method
- Patent number 9,691,579
- Issue date Jun 27, 2017
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass core substrate for integrated circuit devices and methods of...
- Patent number 9,686,861
- Issue date Jun 20, 2017
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of microfluidic devices in package struct...
- Patent number 9,674,945
- Issue date Jun 6, 2017
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package assemblies including a glass solder mask...
- Patent number 9,673,131
- Issue date Jun 6, 2017
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having laminated or embedded glass routi...
- Patent number 9,642,248
- Issue date May 2, 2017
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for hermetic sealing of sensor chips and for their integ...
- Patent number 9,617,148
- Issue date Apr 11, 2017
- Intel Corporation
- Qing Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Debond interconnect structures
- Patent number 9,461,010
- Issue date Oct 4, 2016
- Intel Corporation
- Qing Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass clad microelectronic substrate
- Patent number 9,445,496
- Issue date Sep 13, 2016
- Intel Corporation
- Qing Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductive inertial sensor architecture and fabrication in packaging...
- Patent number 9,429,427
- Issue date Aug 30, 2016
- Intel Corporation
- Qing Ma
- G01 - MEASURING TESTING
Information Patent Grant
Substrate for integrated circuit devices including multi-layer glas...
- Patent number 9,420,707
- Issue date Aug 16, 2016
- Intel Corporation
- Qing Ma
- B32 - LAYERED PRODUCTS
Information Patent Grant
Interposer for hermetic sealing of sensor chips and for their integ...
- Patent number 9,368,429
- Issue date Jun 14, 2016
- Intel Corporation
- Qing Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Techniques, systems and devices related to acceleration measurement
- Patent number 9,297,824
- Issue date Mar 29, 2016
- Intel Corporation
- Qing Ma
- G01 - MEASURING TESTING
Information Patent Grant
Debond interconnect structures
- Patent number 9,269,686
- Issue date Feb 23, 2016
- Intel Corporation
- Qing Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Biosensor utilizing a resonator having a functionalized surface
- Patent number 9,267,944
- Issue date Feb 23, 2016
- Intel Corporation
- Yuegang Zhang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method, apparatus and system for providing metering of acceleration
- Patent number 9,250,261
- Issue date Feb 2, 2016
- Intel Corporation
- Kevin L. Lin
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package with air pressure sensor
- Patent number 9,200,973
- Issue date Dec 1, 2015
- Intel Corporation
- Kevin L. Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Compositions and methods for the treatment of cardiac surgery-assoc...
- Patent number 9,173,918
- Issue date Nov 3, 2015
- Duke University
- Zhiquan Zhang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Die assembly on thin dielectric sheet
- Patent number 9,177,831
- Issue date Nov 3, 2015
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having laminated or embedded glass routi...
- Patent number 9,001,520
- Issue date Apr 7, 2015
- Intel Corporation
- Qing Ma
- B32 - LAYERED PRODUCTS
Information Patent Grant
Compositions and methods for the treatment of myocardial ischemia/r...
- Patent number 8,940,697
- Issue date Jan 27, 2015
- Duke University
- Mihai V. Podgoreanu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Biosensor utilizing a resonator having a functionalized surface
- Patent number 8,940,234
- Issue date Jan 27, 2015
- Intel Corporation
- Yuegang Zhang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Data retention of ferroelectric films by controlling film compositi...
- Patent number 8,644,050
- Issue date Feb 4, 2014
- Intel Corporation
- Li-Peng Wang
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITIONS AND METHODS FOR TREATING POST OPERATIVE COGNITIVE DYSF...
- Publication number 20180153952
- Publication date Jun 7, 2018
- DUKE UNIVERSITY
- Zhiquan Zhang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PACKAGE MEMS SWITCH AND METHOD
- Publication number 20180138001
- Publication date May 17, 2018
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTI...
- Publication number 20170200677
- Publication date Jul 13, 2017
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CLAD MICROELECTRONIC SUBSTRATE
- Publication number 20160343650
- Publication date Nov 24, 2016
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR INTEGRATED CIRCUIT DEVICES INCLUDING MULTI-LAYER GLAS...
- Publication number 20160322290
- Publication date Nov 3, 2016
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR HERMETIC SEALING OF SENSOR CHIPS AND FOR THEIR INTEG...
- Publication number 20160280539
- Publication date Sep 29, 2016
- Intel Corporation
- Qing MA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GLASS CORE SUBSTRATE FOR INTEGRATED CIRCUIT DEVICES AND METHODS OF...
- Publication number 20160284637
- Publication date Sep 29, 2016
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCELEROMETER AND METHOD OF MAKING SAME
- Publication number 20160245841
- Publication date Aug 25, 2016
- Intel Corporation
- Qing MA
- G01 - MEASURING TESTING
Information Patent Application
DEBOND INTERCONNECT STRUCTURES
- Publication number 20160133596
- Publication date May 12, 2016
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AIR PRESSURE SENSOR
- Publication number 20160076961
- Publication date Mar 17, 2016
- Kevin L. Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE ASSEMBLY ON THIN DIELECTRIC SHEET
- Publication number 20160043056
- Publication date Feb 11, 2016
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE MEMS SWITCH AND METHOD
- Publication number 20160020051
- Publication date Jan 21, 2016
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITIONS AND METHODS FOR THE TREATMENT OF MYOCARDIAL ISCHEMIA/R...
- Publication number 20150231205
- Publication date Aug 20, 2015
- DUKE UNIVERSITY
- Mihai V. Podgoreanu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTI...
- Publication number 20150156869
- Publication date Jun 4, 2015
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOSENSOR UTILIZING A RESONATOR HAVING A FUNCTIONALIZED SURFACE
- Publication number 20150125965
- Publication date May 7, 2015
- Yuegang Zhang
- G01 - MEASURING TESTING
Information Patent Application
Methods and Compositions for Activation of Sirtuins with Annexin A1...
- Publication number 20150111830
- Publication date Apr 23, 2015
- DUKE UNIVERSITY
- Zhiquan Zhang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
DIE ASSEMBLY ON THIN DIELECTRIC SHEET
- Publication number 20150091182
- Publication date Apr 2, 2015
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A MAGNETIC MEMS TUNABLE CAPACITOR
- Publication number 20150002984
- Publication date Jan 1, 2015
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ASSEMBLIES INCLUDING A GLASS SOLDER MASK...
- Publication number 20140299999
- Publication date Oct 9, 2014
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compositions and Methods for the Treatment of Cardiac Surgery-Assoc...
- Publication number 20140296149
- Publication date Oct 2, 2014
- Zhiquan Zhang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD, APPARATUS AND SYSTEM FOR PROVIDING METERING OF ACCELERATION
- Publication number 20140182377
- Publication date Jul 3, 2014
- Kevin L. Lin
- G01 - MEASURING TESTING
Information Patent Application
INDUCTIVE INERTIAL SENSOR ARCHITECTURE & FABRICATION IN PACKAGING B...
- Publication number 20140165723
- Publication date Jun 19, 2014
- Qing MA
- G01 - MEASURING TESTING
Information Patent Application
DEBOND INTERCONNECT STRUCTURES
- Publication number 20140106560
- Publication date Apr 17, 2014
- Qing Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTI...
- Publication number 20140085846
- Publication date Mar 27, 2014
- Qing Ma
- B32 - LAYERED PRODUCTS
Information Patent Application
HETEROGENEOUS INTEGRATION OF MICROFLUIDIC DEVICES IN PACKAGE STRUCT...
- Publication number 20140083858
- Publication date Mar 27, 2014
- Weng Hong Teh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACCELEROMETER AND METHOD OF MAKING SAME
- Publication number 20140076051
- Publication date Mar 20, 2014
- Qing MA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE WITH MECHANICAL FUSE
- Publication number 20140002178
- Publication date Jan 2, 2014
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CLAD MICROELECTRONIC SUBSTRATE
- Publication number 20140003009
- Publication date Jan 2, 2014
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AIR PRESSURE SENSOR
- Publication number 20140000377
- Publication date Jan 2, 2014
- Kevin L. Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERPOSER FOR HERMETIC SEALING OF SENSOR CHIPS AND FOR THEIR INTEG...
- Publication number 20130249109
- Publication date Sep 26, 2013
- Qing MA
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Person

Patents Grantslast 30 patents

Semiconductor package with air pressure sensor

Package MEMS switch and method

Methods and compositions for activation of sirtuins with Annexin A1...

Method of making an accelerometer

Method of making glass core substrate for integrated circuit devices

Microelectronic structures having laminated or embedded glass routi...

Glass clad microelectronic substrate

Substrate for integrated circuit devices including multi-layer glas...

Package MEMS switch and method

Glass core substrate for integrated circuit devices and methods of...

Heterogeneous integration of microfluidic devices in package struct...

Integrated circuit package assemblies including a glass solder mask...

Microelectronic structures having laminated or embedded glass routi...

Interposer for hermetic sealing of sensor chips and for their integ...

Debond interconnect structures

Glass clad microelectronic substrate

Inductive inertial sensor architecture and fabrication in packaging...

Substrate for integrated circuit devices including multi-layer glas...

Interposer for hermetic sealing of sensor chips and for their integ...

Techniques, systems and devices related to acceleration measurement

Debond interconnect structures

Biosensor utilizing a resonator having a functionalized surface

Method, apparatus and system for providing metering of acceleration

Semiconductor package with air pressure sensor

Compositions and methods for the treatment of cardiac surgery-assoc...

Die assembly on thin dielectric sheet

Microelectronic structures having laminated or embedded glass routi...

Compositions and methods for the treatment of myocardial ischemia/r...

Biosensor utilizing a resonator having a functionalized surface

Data retention of ferroelectric films by controlling film compositi...

Patents Applicationslast 30 patents

COMPOSITIONS AND METHODS FOR TREATING POST OPERATIVE COGNITIVE DYSF...

PACKAGE MEMS SWITCH AND METHOD

MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTI...

GLASS CLAD MICROELECTRONIC SUBSTRATE

SUBSTRATE FOR INTEGRATED CIRCUIT DEVICES INCLUDING MULTI-LAYER GLAS...

INTERPOSER FOR HERMETIC SEALING OF SENSOR CHIPS AND FOR THEIR INTEG...

GLASS CORE SUBSTRATE FOR INTEGRATED CIRCUIT DEVICES AND METHODS OF...

ACCELEROMETER AND METHOD OF MAKING SAME

DEBOND INTERCONNECT STRUCTURES

SEMICONDUCTOR PACKAGE WITH AIR PRESSURE SENSOR

DIE ASSEMBLY ON THIN DIELECTRIC SHEET

PACKAGE MEMS SWITCH AND METHOD

COMPOSITIONS AND METHODS FOR THE TREATMENT OF MYOCARDIAL ISCHEMIA/R...

MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTI...

BIOSENSOR UTILIZING A RESONATOR HAVING A FUNCTIONALIZED SURFACE

Methods and Compositions for Activation of Sirtuins with Annexin A1...

DIE ASSEMBLY ON THIN DIELECTRIC SHEET

METHOD OF FORMING A MAGNETIC MEMS TUNABLE CAPACITOR

INTEGRATED CIRCUIT PACKAGE ASSEMBLIES INCLUDING A GLASS SOLDER MASK...

Compositions and Methods for the Treatment of Cardiac Surgery-Assoc...

METHOD, APPARATUS AND SYSTEM FOR PROVIDING METERING OF ACCELERATION

INDUCTIVE INERTIAL SENSOR ARCHITECTURE & FABRICATION IN PACKAGING B...

DEBOND INTERCONNECT STRUCTURES

MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTI...

HETEROGENEOUS INTEGRATION OF MICROFLUIDIC DEVICES IN PACKAGE STRUCT...

ACCELEROMETER AND METHOD OF MAKING SAME

SEMICONDUCTOR PACKAGE WITH MECHANICAL FUSE

GLASS CLAD MICROELECTRONIC SUBSTRATE

SEMICONDUCTOR PACKAGE WITH AIR PRESSURE SENSOR

INTERPOSER FOR HERMETIC SEALING OF SENSOR CHIPS AND FOR THEIR INTEG...