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Qing Tang Jiang
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Shanghai, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Wireless power transmission appratus and control method thereof
Patent number
11,770,025
Issue date
Sep 26, 2023
Delta Electronics (Shanghai) Co., Ltd.
Qing Jiang
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Method and structure for copper gap fill plating of interconnect st...
Patent number
8,242,017
Issue date
Aug 14, 2012
Semiconductor Manufacturing International (Shanghai) Corporation
Yang Hui Xiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for improving adhesion between layers in integ...
Patent number
6,958,290
Issue date
Oct 25, 2005
Texas Instruments Incorporated
Richard A. Faust, Jr.
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS
Publication number
20240260228
Publication date
Aug 1, 2024
Intel Corporation
Jimmy Chuang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DIMM COOLING ASSEMBLIES
Publication number
20240260233
Publication date
Aug 1, 2024
Intel Corporation
Ming Zhang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
WIRELESS COMMUNICATION DEVICE AND CONTROL METHOD THEREOF
Publication number
20230308136
Publication date
Sep 28, 2023
DELTA ELECTRONICS (SHANGHAI) CO., LTD.
Yongkai LIAO
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
WIRELESS CHARGING SYSTEM AND CONTROL METHOD THEREOF
Publication number
20230307964
Publication date
Sep 28, 2023
DELTA ELECTRONICS (SHANGHAI) CO., LTD.
Yongkai LIAO
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
WIRELESS POWER TRANSMISSION APPRATUS AND CONTROL METHOD THEREOF
Publication number
20220085649
Publication date
Mar 17, 2022
DELTA ELECTRONICS (SHANGHAI) CO., LTD.
Qing JIANG
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
METHOD AND STRUCTURE FOR COPPER GAP FILL PLATING OF INTERCONNECT ST...
Publication number
20090227103
Publication date
Sep 10, 2009
Semiconductor Manufacturing International (Shanghai) Corporation
Yang Hui Xiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for improving adhesion between layers in integ...
Publication number
20030207562
Publication date
Nov 6, 2003
Richard A. Faust
H01 - BASIC ELECTRIC ELEMENTS