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last 30 patents
Information
Patent Grant
Device and structure and method for forming the same
Patent number
9,876,066
Issue date
Jan 23, 2018
Nanyang Technological University
Qing Zhang
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Integrated passive devices
Patent number
9,449,925
Issue date
Sep 20, 2016
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming passive devices
Patent number
9,349,723
Issue date
May 24, 2016
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming an inductor on a semiconductor wafer
Patent number
9,337,141
Issue date
May 10, 2016
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with solder bump formed on high topography pla...
Patent number
9,240,384
Issue date
Jan 19, 2016
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for forming passive circuit element...
Patent number
8,592,311
Issue date
Nov 26, 2013
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of making integrated passive devices
Patent number
8,409,970
Issue date
Apr 2, 2013
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit system with circuit element and reference plane
Patent number
8,395,053
Issue date
Mar 12, 2013
Stats Chippac Ltd.
Yaojian Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacture of integrated circuit package system with pr...
Patent number
8,389,396
Issue date
Mar 5, 2013
Stats Chippac Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming an inductor on a semiconductor wafer
Patent number
8,309,452
Issue date
Nov 13, 2012
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for forming passive circuit element...
Patent number
8,310,058
Issue date
Nov 13, 2012
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with solder bump formed on high topography pla...
Patent number
8,304,904
Issue date
Nov 6, 2012
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of aligning nanotubes
Patent number
8,216,636
Issue date
Jul 10, 2012
Nanyang Technological University
Bee Eng Mary Chan
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Semiconductor device and method of forming passive devices
Patent number
8,124,490
Issue date
Feb 28, 2012
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with protected conductive layers...
Patent number
8,026,593
Issue date
Sep 27, 2011
Stats Chippac Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming integrated passive devic...
Patent number
7,790,503
Issue date
Sep 7, 2010
STATS ChipPAC, Ltd.
Yaojian Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of forming an inductor on a semiconductor wafer
Patent number
7,772,106
Issue date
Aug 10, 2010
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with integrated passive circuit and method of...
Patent number
7,749,814
Issue date
Jul 6, 2010
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of protecting passivation layer in...
Patent number
7,727,876
Issue date
Jun 1, 2010
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for forming passive circuit element...
Patent number
7,691,747
Issue date
Apr 6, 2010
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming solder bump on high topography plated Cu
Patent number
7,682,959
Issue date
Mar 23, 2010
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method to form a high K dielectric gate insulator layer, a metal ga...
Patent number
6,300,201
Issue date
Oct 9, 2001
Chartered Semiconductor Manufacturing Ltd.
Kai Shao
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEAL RING FOR AL-Ge BONDING
Publication number
20190031502
Publication date
Jan 31, 2019
Agency for Science, Technology and Research
Vivek CHIDAMBARAM
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
NANOFIBER AND USE THEREOF IN AN ELECTRODE
Publication number
20150287997
Publication date
Oct 8, 2015
Nanyang Technological University
Qing Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20150129941
Publication date
May 14, 2015
Nanyang Technological University
Qing Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making Integrated Passive Devices
Publication number
20130175668
Publication date
Jul 11, 2013
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device with Solder Bump Formed on High Topography Pla...
Publication number
20130015575
Publication date
Jan 17, 2013
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Forming an Inductor on a Semiconductor Wafer
Publication number
20130015555
Publication date
Jan 17, 2013
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method for Forming Passive Circuit Element...
Publication number
20130015554
Publication date
Jan 17, 2013
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Protecting Passivation Layer in...
Publication number
20120211881
Publication date
Aug 23, 2012
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Passive Devices
Publication number
20120126369
Publication date
May 24, 2012
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURE OF INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PR...
Publication number
20120003830
Publication date
Jan 5, 2012
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Forming an Inductor on a Semiconductor Wafer
Publication number
20100264516
Publication date
Oct 21, 2010
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Protecting Passivation Layer in...
Publication number
20100200985
Publication date
Aug 12, 2010
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method for Forming Passive Circuit Element...
Publication number
20100140737
Publication date
Jun 10, 2010
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device with Solder Bump Formed on High Topography Pla...
Publication number
20100133687
Publication date
Jun 3, 2010
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Device Carrying an Intergrated Circuit/Components and Method of Pro...
Publication number
20100025095
Publication date
Feb 4, 2010
Li Hui Guo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF ALIGNING NANOTUBES
Publication number
20090246408
Publication date
Oct 1, 2009
Nanyang Technological University
Bee Eng Mary Chan
B82 - NANO-TECHNOLOGY
Information
Patent Application
Semiconductor Device With Integrated Passive Circuit and Method of...
Publication number
20090230542
Publication date
Sep 17, 2009
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Integrated Passive Devic...
Publication number
20090155959
Publication date
Jun 18, 2009
STATS ChipPAC, Ltd.
Yaojian Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor Device and Method for Forming Passive Circuit Element...
Publication number
20090140381
Publication date
Jun 4, 2009
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making Integrated Passive Devices
Publication number
20090140421
Publication date
Jun 4, 2009
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Forming an Inductor on a Semiconductor Wafer
Publication number
20090117702
Publication date
May 7, 2009
STATS CHIPPAC, LTD.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT SYSTEM WITH CIRCUIT ELEMENT AND REFERENCE PLANE
Publication number
20090004504
Publication date
Jan 1, 2009
Yaojian Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PROTECTED CONDUCTIVE LAYERS
Publication number
20080237880
Publication date
Oct 2, 2008
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Forming Solder Bump on High Topography Plated Cu
Publication number
20080230902
Publication date
Sep 25, 2008
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Protecting Passivation Layer in...
Publication number
20080150161
Publication date
Jun 26, 2008
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Passive Devices
Publication number
20080153245
Publication date
Jun 26, 2008
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS