Qingchun He

Person

Tianjin, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor devices having ribbon wires
- Patent number 9,570,325
- Issue date Feb 14, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Liqiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame having vertical connection bars
- Patent number 9,355,944
- Issue date May 31, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Peng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit device having bent leads
- Patent number 9,177,836
- Issue date Nov 3, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Peng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of assembling same
- Patent number 8,969,135
- Issue date Mar 3, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Peng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brace for long wire bond
- Patent number 8,692,134
- Issue date Apr 8, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and lead frame therefor
- Patent number 8,643,158
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Peng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making chip-on-lead package
- Patent number 8,642,395
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Zhe Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame sheet
- Patent number 8,486,540
- Issue date Jul 16, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Ting Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device with nested rows of contacts
- Patent number 8,080,448
- Issue date Dec 20, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Ping Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES HAVING RIBBON WIRES
- Publication number 20160190086
- Publication date Jun 30, 2016
- FREESCALE SEMICONDUCTOR, INC.
- LIQIANG XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND LEAD FRAME HAVING VERTICAL CONNECTION BARS
- Publication number 20160141230
- Publication date May 19, 2016
- Peng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METALLIZATION PATTERNS FOR INTEGRATED CIRCUITS
- Publication number 20150235969
- Publication date Aug 20, 2015
- Hanmin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20140246767
- Publication date Sep 4, 2014
- Peng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING MACHINE AND METHOD FOR TESTING WIRE BOND CONNECTIONS
- Publication number 20140103096
- Publication date Apr 17, 2014
- Hanmin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND LEAD FRAME THEREFOR
- Publication number 20120248590
- Publication date Oct 4, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Peng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH NESTED ROWS OF CONTACTS
- Publication number 20120112333
- Publication date May 10, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Qiang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH RECESSED DIE BOND AREA
- Publication number 20110241187
- Publication date Oct 6, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Liping Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME SHEET
- Publication number 20110212341
- Publication date Sep 1, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Ting Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR SEMICONDUCTOR DIE
- Publication number 20110193207
- Publication date Aug 11, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Zhaojun Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING SEMICONDUCTOR DEVICE
- Publication number 20110165729
- Publication date Jul 7, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Peng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND METHOD OF FORMING SAME
- Publication number 20110065240
- Publication date Mar 17, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Xu GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING CHIP-ON-LEAD PACKAGE
- Publication number 20100248426
- Publication date Sep 30, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Zhe Li
- H01 - BASIC ELECTRIC ELEMENTS

Qingchun He

Person

Patents Grantslast 30 patents

Packaged semiconductor devices having ribbon wires

Semiconductor device and lead frame having vertical connection bars

Packaged integrated circuit device having bent leads

Semiconductor device and method of assembling same

Brace for long wire bond

Semiconductor package and lead frame therefor

Method of making chip-on-lead package

Lead frame sheet

Semiconductor device with nested rows of contacts

Patents Applicationslast 30 patents

PACKAGED SEMICONDUCTOR DEVICES HAVING RIBBON WIRES

SEMICONDUCTOR DEVICE AND LEAD FRAME HAVING VERTICAL CONNECTION BARS

BACKSIDE METALLIZATION PATTERNS FOR INTEGRATED CIRCUITS

SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME

WIRE BONDING MACHINE AND METHOD FOR TESTING WIRE BOND CONNECTIONS

SEMICONDUCTOR PACKAGE AND LEAD FRAME THEREFOR

SEMICONDUCTOR DEVICE WITH NESTED ROWS OF CONTACTS

LEAD FRAME WITH RECESSED DIE BOND AREA

LEAD FRAME SHEET

LEAD FRAME FOR SEMICONDUCTOR DIE

METHOD OF PACKAGING SEMICONDUCTOR DEVICE

LEAD FRAME AND METHOD OF FORMING SAME

METHOD OF MAKING CHIP-ON-LEAD PACKAGE