Qinghua Huang

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Shenzhen, CN

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Patents Applicationslast 30 patents

Information Patent Application
RECEIVING MODULE, PACKAGING STRUCTURE, PRINTED CIRCUIT BOARD, AND E...
- Publication number 20240223132
- Publication date Jul 4, 2024
- Honor Device Co., Ltd.
- Tong WANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for Manufacturing Die
- Publication number 20230395587
- Publication date Dec 7, 2023
- Honor Device Co., Ltd.
- Qinghua Huang
- H01 - BASIC ELECTRIC ELEMENTS