Qinglin Song

Person

Beijing, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Optical engine and AR device
- Patent number 12,164,113
- Issue date Dec 10, 2024
- GOERTEK OPTICAL TECHNOLOGY CO., LTD
- Yangchun Deng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Shielding process for SIP packaging
- Patent number 12,107,053
- Issue date Oct 1, 2024
- Weifang Goertek Microelectronics Co., Ltd.
- Juncheng Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method for circuit units comprising circuit baseplate
- Patent number 12,074,037
- Issue date Aug 27, 2024
- Weifang Goertek Microelectronics Co., Ltd.
- Haisheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detecting coverage rate of intermetallic compound
- Patent number 12,031,920
- Issue date Jul 9, 2024
- Weifang Goertek Microelectronics Co., Ltd.
- Dingguo Zhong
- G01 - MEASURING TESTING
Information Patent Grant
Method for packaging chip
- Patent number 12,002,685
- Issue date Jun 4, 2024
- Weifang Goertek Microelectronics Co., Ltd.
- Baoguan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shielding structure and manufacturing method thereo...
- Patent number 11,882,681
- Issue date Jan 23, 2024
- Weifang Goertek Microelectronics Co. Ltd.
- Kaiwei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated structure of mems microphone and air pressure sensor and...
- Patent number 11,516,595
- Issue date Nov 29, 2022
- Weifang Goertek Microelectronics Co., Ltd.
- Dexin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing coil, coil and electronic device
- Patent number 11,417,463
- Issue date Aug 16, 2022
- GoerTek Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro laser diode projector and electronics apparatus
- Patent number 11,099,467
- Issue date Aug 24, 2021
- GoerTek Inc.
- Zhe Wang
- G02 - OPTICS
Information Patent Grant
Acoustic sensor integrated MEMS microphone structure and fabricatio...
- Patent number 10,349,187
- Issue date Jul 9, 2019
- GOERTEK INC.
- Junkai Zhan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone with dustproof through holes
- Patent number 10,277,968
- Issue date Apr 30, 2019
- Goertek Inc.
- Guanxun Qiu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Cavity forming method for a sensor chip, manufacturing method there...
- Patent number 10,246,323
- Issue date Apr 2, 2019
- Goertek, Inc.
- Mengjin Cai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging structure of integrated sensor
- Patent number 10,177,055
- Issue date Jan 8, 2019
- GoerTek Inc.
- Luyu Duanmu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and method for packaging the same
- Patent number 9,108,840
- Issue date Aug 18, 2015
- GoerTek Inc.
- Zhe Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Condenser microphone chip
- Patent number 8,121,315
- Issue date Feb 21, 2012
- Goer Tek Inc.
- Qinglin Song
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE, MICROPHONE UNIT AND ELE...
- Publication number 20240334132
- Publication date Oct 3, 2024
- GOERTEK MICROELECTRONICS INC.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL ENGINE AND AR DEVICE
- Publication number 20240053616
- Publication date Feb 15, 2024
- Yangchun DENG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PACKAGING METHOD FOR CIRCUIT UNITS
- Publication number 20220406619
- Publication date Dec 22, 2022
- WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
- Haisheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE FOR CIRCUIT UNITS
- Publication number 20220408549
- Publication date Dec 22, 2022
- WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
- Haisheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PACKAGING CHIP
- Publication number 20220367209
- Publication date Nov 17, 2022
- WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
- Baoguan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING PROCESS FOR SIP PACKAGING
- Publication number 20220254731
- Publication date Aug 11, 2022
- WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
- Juncheng Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELDING STRUCTURE AND MANUFACTURING METHOD THEREO...
- Publication number 20220248573
- Publication date Aug 4, 2022
- WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
- Kaiwei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR DETECTING COVERAGE RATE OF INTERMETALLIC COMPOUND
- Publication number 20220236195
- Publication date Jul 28, 2022
- WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
- Dingguo Zhong
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED STRUCTURE OF MEMS MICROPHONE AND AIR PRESSURE SENSOR AND...
- Publication number 20210021937
- Publication date Jan 21, 2021
- WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
- Dexin WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING COIL, COIL AND ELECTRONIC DEVICE
- Publication number 20200365321
- Publication date Nov 19, 2020
- Goertek, Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING COIL, COIL AND ELECTRONIC DEVICE
- Publication number 20200365320
- Publication date Nov 19, 2020
- Goertek, Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LASER DIODE PROJECTOR AND ELECTRONICS APPARATUS
- Publication number 20200241407
- Publication date Jul 30, 2020
- GOERTEK INC
- Zhe WANG
- G02 - OPTICS
Information Patent Application
ACOUSTIC SENSOR INTEGRATED MEMS MICROPHONE STRUCTURE AND FABRICATIO...
- Publication number 20180359571
- Publication date Dec 13, 2018
- GOERTEK INC.
- Junkai ZHAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAVITY FORMING METHOD FOR A SENSOR CHIP, MANUFACTURING METHOD THERE...
- Publication number 20180086631
- Publication date Mar 29, 2018
- Goertek, Inc.
- Mengjin Cai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING STRUCTURE AND METHOD OF INTEGRATED SENSOR
- Publication number 20180068914
- Publication date Mar 8, 2018
- Goertek lnc
- Luyu Duanmu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Z-AXIS STRUCTURE IN ACCELEROMETER
- Publication number 20170363656
- Publication date Dec 21, 2017
- GOERTEK INC.
- Huabin Fang
- G01 - MEASURING TESTING
Information Patent Application
MICROPHONE WITH DUSTPROOF THROUGH HOLES
- Publication number 20170332161
- Publication date Nov 16, 2017
- GOERTEK INC
- Guanxun QIU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MEMS MICROPHONE AND METHOD FOR PACKAGING THE SAME
- Publication number 20140008740
- Publication date Jan 9, 2014
- Zhe Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDENSER MICROPHONE CHIP
- Publication number 20080232615
- Publication date Sep 25, 2008
- Goer Tek Inc.
- Qinglin Song
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Qinglin Song

Person

Patents Grantslast 30 patents

Optical engine and AR device

Shielding process for SIP packaging

Packaging method for circuit units comprising circuit baseplate

Method for detecting coverage rate of intermetallic compound

Method for packaging chip

Electromagnetic shielding structure and manufacturing method thereo...

Integrated structure of mems microphone and air pressure sensor and...

Method for manufacturing coil, coil and electronic device

Micro laser diode projector and electronics apparatus

Acoustic sensor integrated MEMS microphone structure and fabricatio...

Microphone with dustproof through holes

Cavity forming method for a sensor chip, manufacturing method there...

Packaging structure of integrated sensor

MEMS microphone and method for packaging the same

Condenser microphone chip

Patents Applicationslast 30 patents

MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE, MICROPHONE UNIT AND ELE...

OPTICAL ENGINE AND AR DEVICE

PACKAGING METHOD FOR CIRCUIT UNITS

PACKAGING STRUCTURE FOR CIRCUIT UNITS

METHOD FOR PACKAGING CHIP

SHIELDING PROCESS FOR SIP PACKAGING

ELECTROMAGNETIC SHIELDING STRUCTURE AND MANUFACTURING METHOD THEREO...

METHOD FOR DETECTING COVERAGE RATE OF INTERMETALLIC COMPOUND

INTEGRATED STRUCTURE OF MEMS MICROPHONE AND AIR PRESSURE SENSOR AND...

METHOD FOR MANUFACTURING COIL, COIL AND ELECTRONIC DEVICE

METHOD FOR MANUFACTURING COIL, COIL AND ELECTRONIC DEVICE

MICRO LASER DIODE PROJECTOR AND ELECTRONICS APPARATUS

ACOUSTIC SENSOR INTEGRATED MEMS MICROPHONE STRUCTURE AND FABRICATIO...

CAVITY FORMING METHOD FOR A SENSOR CHIP, MANUFACTURING METHOD THERE...

PACKAGING STRUCTURE AND METHOD OF INTEGRATED SENSOR

Z-AXIS STRUCTURE IN ACCELEROMETER

MICROPHONE WITH DUSTPROOF THROUGH HOLES

MEMS MICROPHONE AND METHOD FOR PACKAGING THE SAME

CONDENSER MICROPHONE CHIP