Qingwen Deng

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Hangzhou, CN

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Patents Grantslast 30 patents

Information Patent Grant
System on wafer assembly structure and assembly method thereof
- Patent number 12,112,991
- Issue date Oct 8, 2024
- ZHEJIANG LAB
- Qingwen Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Software-defined wafer-level switching system design method and app...
- Patent number 11,983,481
- Issue date May 14, 2024
- ZHEJIANG LAB
- Zhiquan Wan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnection structure of system on wafer and PCB base on TSV pr...
- Patent number 11,705,437
- Issue date Jul 18, 2023
- ZHEJIANG LAB
- Qingwen Deng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOFTWARE-DEFINED WAFER-LEVEL SWITCHING SYSTEM DESIGN METHOD AND APP...
- Publication number 20240020455
- Publication date Jan 18, 2024
- ZHEJIANG LAB
- Zhiquan WAN
- G06 - COMPUTING CALCULATING COUNTING