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last 30 patents
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Patent Application
COVERS FOR ELECTRONIC DEVICES
Publication number
20240158943
Publication date
May 16, 2024
Hewlett-Packard Development Company, L.P.
Qingyong GUO
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
COATED METAL ALLOY SUBSTRATE AND PROCESS FOR PRODUCTION THEREOF
Publication number
20220403528
Publication date
Dec 22, 2022
Hewlett-Packard Development Company, L.P.
KUAN-TING WU
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Coated Metal Alloy Substrate and Process for Production Thereof
Publication number
20220349082
Publication date
Nov 3, 2022
Hewlett-Packard Development Company, L.P.
Qingyong Guo
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTRONIC DEVICE HOUSINGS WITH ELECTROLESS PLATING LAYERS
Publication number
20220341052
Publication date
Oct 27, 2022
Hewlett-Packard Development Company, L.P.
Qingyong Guo
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
CUTTING FLUIDS
Publication number
20220143770
Publication date
May 12, 2022
Hewlett-Packard Development Company, L.P.
Kuan-Ting WU
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR