TREA

QINGYU MENG

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  • BEIJING, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer grounding methodology
    • Patent number 8,094,428
    • Issue date Jan 10, 2012
    • Hermes-Microvision, Inc.
    • Yi Xiang Wang
    • B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER GROUNDING METHODOLOGY
    • Publication number 20100103583
    • Publication date Apr 29, 2010
    • HERMES-MICROVISION, INC.
    • YI XIANG WANG
    • B82 - NANO-TECHNOLOGY