Qiong Yu

Person

Suzhou, Jiangsu Province, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging method and packaging structure
- Patent number 10,529,758
- Issue date Jan 7, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint recognition chip packaging structure and packaging method
- Patent number 10,133,907
- Issue date Nov 20, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer-level chip package structure and packaging method
- Patent number 10,126,151
- Issue date Nov 13, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint recognition chip packaging structure and packaging method
- Patent number 10,108,837
- Issue date Oct 23, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint recognition chip packaging structure and packaging method
- Patent number 10,096,643
- Issue date Oct 9, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip packaging method and package structure
- Patent number 10,090,217
- Issue date Oct 2, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip to wafer package with top electrodes and method of forming
- Patent number 9,748,162
- Issue date Aug 29, 2017
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging structure for image sensors with packaging co...
- Patent number 9,601,531
- Issue date Mar 21, 2017
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging method of BSI image sensors having different...
- Patent number 9,455,298
- Issue date Sep 27, 2016
- China Wafer Level CSP Co., Ltd.
- Zhi-Qi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging method of BSI image sensors having different...
- Patent number 9,305,961
- Issue date Apr 5, 2016
- China Wafer Level CSP Co., Ltd.
- Zhi-Qi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package structure and method
- Patent number 9,299,735
- Issue date Mar 29, 2016
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging structure for image sensors and wafer level p...
- Patent number 9,231,018
- Issue date Jan 5, 2016
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20180129848
- Publication date May 10, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
- Publication number 20180114048
- Publication date Apr 26, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20180108585
- Publication date Apr 19, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE
- Publication number 20180047772
- Publication date Feb 15, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND PACKAGE STRUCTURE
- Publication number 20170287797
- Publication date Oct 5, 2017
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER-LEVEL CHIP PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20170284837
- Publication date Oct 5, 2017
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G01 - MEASURING TESTING
Information Patent Application
FINGERPRINT RECOGNITION CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20170162620
- Publication date Jun 8, 2017
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGERPRINT RECOGNITION CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20170147851
- Publication date May 25, 2017
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGERPRINT RECOGNITION CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20170140195
- Publication date May 18, 2017
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER-LEVEL PACKAGING METHOD OF BSI IMAGE SENSORS HAVING DIFFERENT...
- Publication number 20160148972
- Publication date May 26, 2016
- China Wafer Level CSP Co., Ltd.
- Zhi-Qi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20150200153
- Publication date Jul 16, 2015
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE STRUCTURE AND METHOD
- Publication number 20150137294
- Publication date May 21, 2015
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING STRUCTURE FOR IMAGE SENSORS AND WAFER LEVEL P...
- Publication number 20150054108
- Publication date Feb 26, 2015
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING STRUCTURE FOR IMAGE SENSORS AND WAFER LEVEL P...
- Publication number 20150054109
- Publication date Feb 26, 2015
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING METHOD OF BSI IMAGE SENSORS HAVING DIFFERENT...
- Publication number 20140191352
- Publication date Jul 10, 2014
- China Wafer Level CSP Co., Ltd.
- Zhi-Qi WANG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Packaging method and packaging structure

Fingerprint recognition chip packaging structure and packaging method

Wafer-level chip package structure and packaging method

Fingerprint recognition chip packaging structure and packaging method

Fingerprint recognition chip packaging structure and packaging method

Chip packaging method and package structure

Chip to wafer package with top electrodes and method of forming

Wafer-level packaging structure for image sensors with packaging co...

Wafer-level packaging method of BSI image sensors having different...

Wafer-level packaging method of BSI image sensors having different...

Image sensor package structure and method

Wafer level packaging structure for image sensors and wafer level p...

Patents Applicationslast 30 patents

CHIP PACKAGING STRUCTURE AND PACKAGING METHOD

CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE

CHIP PACKAGING STRUCTURE AND PACKAGING METHOD

PACKAGING METHOD AND PACKAGING STRUCTURE

CHIP PACKAGING METHOD AND PACKAGE STRUCTURE

WAFER-LEVEL CHIP PACKAGE STRUCTURE AND PACKAGING METHOD

FINGERPRINT RECOGNITION CHIP PACKAGING STRUCTURE AND PACKAGING METHOD

FINGERPRINT RECOGNITION CHIP PACKAGING STRUCTURE AND PACKAGING METHOD

FINGERPRINT RECOGNITION CHIP PACKAGING STRUCTURE AND PACKAGING METHOD

WAFER-LEVEL PACKAGING METHOD OF BSI IMAGE SENSORS HAVING DIFFERENT...

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

IMAGE SENSOR PACKAGE STRUCTURE AND METHOD

WAFER LEVEL PACKAGING STRUCTURE FOR IMAGE SENSORS AND WAFER LEVEL P...

WAFER LEVEL PACKAGING STRUCTURE FOR IMAGE SENSORS AND WAFER LEVEL P...

WAFER-LEVEL PACKAGING METHOD OF BSI IMAGE SENSORS HAVING DIFFERENT...