QIXING BAI

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ZHAOQING CITY, CN

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Patents Grantslast 30 patents

Information Patent Grant
Thermistor chip and preparation method thereof
- Patent number 11,631,511
- Issue date Apr 18, 2023
- DINGSENSE ELECTRONICS TECHNOLOGY CO., LTD
- Xiaohai Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite thermistor chip and preparation method thereof
- Patent number 10,636,550
- Issue date Apr 28, 2020
- Exsense Electronics Technology Co., Ltd.
- Zhaoxiang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High precision high reliability and quick response thermosensitive...
- Patent number 10,330,539
- Issue date Jun 25, 2019
- EXSENSE ELECTRONICS TECHNOLOGY CO., LTD
- Wenting Chen
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
THERMISTOR CHIP AND PREPARATION METHOD THEREOF
- Publication number 20220059260
- Publication date Feb 24, 2022
- DINGSENSE ELECTRONICS TECHNOLOGY CO., LTD
- Xiaohai BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE THERMISTOR CHIP AND PREPARATION METHOD THEREOF
- Publication number 20200090840
- Publication date Mar 19, 2020
- Zhaoxiang DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSENSITIVE CHIP FOR COMPOSITE ELECTRODE
- Publication number 20170250011
- Publication date Aug 31, 2017
- EXSENSE ELECTRONICS TECHNOLOGY CO., LTD
- KUN WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PRECISION HIGH RELIABILITY AND QUICK RESPONSE THERMOSENSITIVE...
- Publication number 20170211991
- Publication date Jul 27, 2017
- EXSENSE ELECTRONICS TECHNOLOGY CO., LTD
- Wenting Chen
- G01 - MEASURING TESTING