Qizhuo Zhuo

Person

Irvine, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sinterable films and pastes and methods for use thereof
- Patent number 12,042,883
- Issue date Jul 23, 2024
- Henkel AG & Co. KGaA
- Pukun Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sinterable films and pastes and methods for use thereof
- Patent number 11,745,294
- Issue date Sep 5, 2023
- Henkel AG & Co., KGaA
- Pukun Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for shielding system-in-package assemblies from electromagne...
- Patent number 11,304,346
- Issue date Apr 12, 2022
- Henkel AG & Co.KGaA
- Xuan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compositions for gap coating and/or filling in or between electroni...
- Patent number 10,985,108
- Issue date Apr 20, 2021
- Henkel IP & Holding GmbH
- Xuan Hong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Compositions for gap coating and/or filling in or between electroni...
- Patent number 10,937,740
- Issue date Mar 2, 2021
- Henkel IP & Holding GmbH
- Xuan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Achieving electromagnetic interference shielding protection by depo...
- Patent number 10,858,523
- Issue date Dec 8, 2020
- Henkel IP & Holding GmbH
- Junbo Gao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for shielding system-in-package assemblies from electromagne...
- Patent number 10,834,858
- Issue date Nov 10, 2020
- Henkel IP & Holding GmbH
- Xuan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene-containing materials for coating and gap filling applications
- Patent number 10,741,503
- Issue date Aug 11, 2020
- Henkel IP & Holding GmbH
- Xuan Hong
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Wafer back side coating as dicing tape adhesive
- Patent number 9,230,888
- Issue date Jan 5, 2016
- Henkel IP & Holding GmbH
- Gyanendra Dutt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
B-stageable and skip-curable wafer back side coating adhesives
- Patent number 8,759,422
- Issue date Jun 24, 2014
- Henkel IP & Holding GmbH
- Eric C. Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Highly conductive composition for wafer coating
- Patent number 7,422,707
- Issue date Sep 9, 2008
- National Starch and Chemical Investment Holding Corporation
- Qizhuo Zhuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION FOR NON-CONDUCTIVE FILM WITH EXCELLENT HIGH TEMPE...
- Publication number 20240209166
- Publication date Jun 27, 2024
- Henkel AG & Co. KGaA
- Jie Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR NON-CONDUCTIVE FILM WITH EXCELLENT HIGH TEMPE...
- Publication number 20240174854
- Publication date May 30, 2024
- Henkel AG & Co. KGaA
- Jie Bai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRICALLY CONDUCTIVE COMPOSITIONS CAPABLE OF SINTERING
- Publication number 20240076488
- Publication date Mar 7, 2024
- Henkel AG & Co. KGaA
- Bo Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERABLE FILMS AND PASTES AND METHODS FOR USE THEREOF
- Publication number 20230321765
- Publication date Oct 12, 2023
- Henkel AG & Co., KGaA
- Pukun Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SHIELDING SYSTEM-IN-PACKAGE ASSEMBLIES FROM ELECTROMAGNE...
- Publication number 20210092884
- Publication date Mar 25, 2021
- Henkel IP & Holding GmbH
- Xuan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SHIELDING SYSTEM-IN-PACKAGE ASSEMBLIES FROM ELECTROMAGNE...
- Publication number 20200084924
- Publication date Mar 12, 2020
- Henkel IP & Holding GmbH
- Xuan Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GRAPHENE-CONTAINING MATERIALS FOR COATING AND GAP FILLING APPLICATIONS
- Publication number 20190206805
- Publication date Jul 4, 2019
- Henkel IP & Holding GmbH
- Xuan HONG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOSITIONS FOR GAP COATING AND/OR FILLING IN OR BETWEEN ELECTRONI...
- Publication number 20190096822
- Publication date Mar 28, 2019
- Henkel IP & Holding GmbH
- Xuan Hong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SINTERABLE FILMS AND PASTES AND METHODS FOR USE THEREOF
- Publication number 20180056449
- Publication date Mar 1, 2018
- Henkel IP & Holding GmbH
- Pukun ZHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER BACK SIDE COATING AS DICING TAPE ADHESIVE
- Publication number 20140225283
- Publication date Aug 14, 2014
- Henkel Corporation
- Gyanendra Dutt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
B-STAGEABLE AND SKIP-CURABLE WAFER BACK SIDE COATING ADHESIVES
- Publication number 20130197130
- Publication date Aug 1, 2013
- HENKEL CORPORATION
- Eric C. Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Highly conductive composition for wafer coating
- Publication number 20080164612
- Publication date Jul 10, 2008
- Qizhuo Zhuo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HIGHLY CONDUCTIVE COMPOSITION FOR WAFER COATING
- Publication number 20080166543
- Publication date Jul 10, 2008
- Qizhuo Zhuo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Qizhuo Zhuo

Person

Patents Grantslast 30 patents

Sinterable films and pastes and methods for use thereof

Sinterable films and pastes and methods for use thereof

Method for shielding system-in-package assemblies from electromagne...

Compositions for gap coating and/or filling in or between electroni...

Compositions for gap coating and/or filling in or between electroni...

Achieving electromagnetic interference shielding protection by depo...

Method for shielding system-in-package assemblies from electromagne...

Graphene-containing materials for coating and gap filling applications

Wafer back side coating as dicing tape adhesive

B-stageable and skip-curable wafer back side coating adhesives

Highly conductive composition for wafer coating

Patents Applicationslast 30 patents

RESIN COMPOSITION FOR NON-CONDUCTIVE FILM WITH EXCELLENT HIGH TEMPE...

RESIN COMPOSITION FOR NON-CONDUCTIVE FILM WITH EXCELLENT HIGH TEMPE...

ELECTRICALLY CONDUCTIVE COMPOSITIONS CAPABLE OF SINTERING

SINTERABLE FILMS AND PASTES AND METHODS FOR USE THEREOF

METHOD FOR SHIELDING SYSTEM-IN-PACKAGE ASSEMBLIES FROM ELECTROMAGNE...

METHOD FOR SHIELDING SYSTEM-IN-PACKAGE ASSEMBLIES FROM ELECTROMAGNE...

GRAPHENE-CONTAINING MATERIALS FOR COATING AND GAP FILLING APPLICATIONS

COMPOSITIONS FOR GAP COATING AND/OR FILLING IN OR BETWEEN ELECTRONI...

SINTERABLE FILMS AND PASTES AND METHODS FOR USE THEREOF

WAFER BACK SIDE COATING AS DICING TAPE ADHESIVE

B-STAGEABLE AND SKIP-CURABLE WAFER BACK SIDE COATING ADHESIVES

Highly conductive composition for wafer coating

HIGHLY CONDUCTIVE COMPOSITION FOR WAFER COATING