Quan Chen

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Protective packaging for integrated circuit device
- Patent number 9,196,557
- Issue date Nov 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jianshe Bi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for molding semiconductor device
- Patent number 8,652,384
- Issue date Feb 18, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Quan Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROTECTIVE PACKAGING FOR INTEGRATED CIRCUIT DEVICE
- Publication number 20150332985
- Publication date Nov 19, 2015
- Jianshe Bi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MOLDING SEMICONDUCTOR DEVICE
- Publication number 20130005087
- Publication date Jan 3, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Quan Chen
- H01 - BASIC ELECTRIC ELEMENTS