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Quan Qi
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Corvallis, OR, US
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last 30 patents
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Patent Grant
Package for a micro-electro mechanical device
Patent number
9,006,877
Issue date
Apr 14, 2015
Hewlett-Packard Development Company, L.P.
Don Michael
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Package for a micro-electro mechanical device
Patent number
7,465,600
Issue date
Dec 16, 2008
Hewlett-Packard Development Company, L.P.
Don Michael
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Micro-displays
Patent number
7,436,571
Issue date
Oct 14, 2008
Hewlett-Packard Development Company, L.P.
John R Sterner
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
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Patent Grant
System and a method for fluid filling wafer level packages
Patent number
6,858,466
Issue date
Feb 22, 2005
Hewlett-Packard Development Company, L.P.
Bradley Bower
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
PACKAGE FOR A MICRO-ELECTRO MECHANICAL DEVICE
Publication number
20090057790
Publication date
Mar 5, 2009
Don Michael
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Micro-displays
Publication number
20060082737
Publication date
Apr 20, 2006
John R. Sterner
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
Package for a micro-electro mechanical device
Publication number
20050173769
Publication date
Aug 11, 2005
Don Michael
B81 - MICRO-STRUCTURAL TECHNOLOGY