Quan-Qun SU

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New Taipei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wafer coating system and method of manufacturing chip package
- Patent number 10,388,541
- Issue date Aug 20, 2019
- Xintec Inc.
- Yu-Tung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER COATING SYSTEM AND METHOD OF MANUFACTURING CHIP PACKAGE
- Publication number 20160307779
- Publication date Oct 20, 2016
- XINTEC INC.
- Yu-Tung CHEN
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...