Quanbo Zou

Follow

Person

Eindhoven, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Method of bonding a semiconductor device to a support substrate
- Patent number 9,343,612
- Issue date May 17, 2016
- Koninklijke Philips N.V.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LASER DE-BOND OF CARRIER WAFER FROM DEVICE WAFTER
- Publication number 20150228849
- Publication date Aug 13, 2015
- Koninklijke Philips N.V.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING A SEMICONDUCTOR DEVICE TO A SUPPORT SUBSTRATE
- Publication number 20140141552
- Publication date May 22, 2014
- Koninklijke Philips N.V.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS