Quanbo Zou

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Pleasanton, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of bonding a semiconductor device to a support substrate
- Patent number 11,721,788
- Issue date Aug 8, 2023
- Lumileds LLC
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with stress-buffer layer under metallization layer
- Patent number 10,050,180
- Issue date Aug 14, 2018
- Lumileds LLC
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with stress-buffer layer under metallization layer
- Patent number 9,640,729
- Issue date May 2, 2017
- Koninklijke Philips N.V.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LED WITH STRESS-BUFFER LAYER UNDER METALLIZATION LAYER
- Publication number 20170358715
- Publication date Dec 14, 2017
- Koninklijke Philips N.V.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED WITH STRESS-BUFFER LAYER UNDER METALLIZATION LAYER
- Publication number 20160329468
- Publication date Nov 10, 2016
- Koninklijke Philips N.V.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING A SEMICONDUCTOR DEVICE TO A SUPPORT SUBSTRATE
- Publication number 20160247969
- Publication date Aug 25, 2016
- Koninklijke Philips N.V.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS