Quat T. Vu

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated re-combiner for electroosmotic pumps using porous frits
- Patent number 7,723,208
- Issue date May 25, 2010
- Intel Corporation
- Sarah E. Kim
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Method of forming a stack of heat generating integrated circuit chi...
- Patent number 7,696,015
- Issue date Apr 13, 2010
- Intel Corporation
- Sarah E. Kim
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Electroosmotic pump using nanoporous dielectric frit
- Patent number 7,667,319
- Issue date Feb 23, 2010
- Intel Corporation
- R. Scott List
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Using external radiators with electroosmotic pumps for cooling inte...
- Patent number 7,576,432
- Issue date Aug 18, 2009
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electroosmotic pumps using porous frits for cooling integr...
- Patent number 7,274,106
- Issue date Sep 25, 2007
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming a direct build-up layer on an encapsulated die...
- Patent number 7,189,596
- Issue date Mar 13, 2007
- Intel Corporation
- Chun Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with carbon nanotubes
- Patent number 7,126,207
- Issue date Oct 24, 2006
- Intel Corporation
- Larry E. Mosley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroosmotic pumps using porous frits for cooling integrated circ...
- Patent number 7,084,495
- Issue date Aug 1, 2006
- Intel Corporation
- Sarah E. Kim
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Microelectronic substrates with integrated devices
- Patent number 7,078,788
- Issue date Jul 18, 2006
- Intel Corporation
- Quat T. Vu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for packaging a microelectronic device using on-die bond pad...
- Patent number 7,071,024
- Issue date Jul 4, 2006
- Intel Corporation
- Steven Towle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using external radiators with electroosmotic pumps for cooling inte...
- Patent number 6,992,381
- Issue date Jan 31, 2006
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-osmotic pumps and micro-channels
- Patent number 6,981,849
- Issue date Jan 3, 2006
- Intel Corporation
- Sarah E. Kim
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Method to protect an encapsulated die package during back grinding...
- Patent number 6,964,889
- Issue date Nov 15, 2005
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to protect an encapsulated die package during back grinding...
- Patent number 6,902,950
- Issue date Jun 7, 2005
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device having signal distribution functionality on...
- Patent number 6,894,399
- Issue date May 17, 2005
- Intel Corporation
- Quat T. Vu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a SDI electroosmotic pump using nanoporous dielect...
- Patent number 6,861,274
- Issue date Mar 1, 2005
- Intel Corporation
- R. Scott List
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Integrated core microelectronic package
- Patent number 6,825,063
- Issue date Nov 30, 2004
- Intel Corporation
- Quat T. Vu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for capacitively coupling electronic devices
- Patent number 6,790,704
- Issue date Sep 14, 2004
- Intel Corporation
- Brian Doyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
COF packaged semiconductor
- Patent number 6,737,754
- Issue date May 18, 2004
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic substrate with integrated devices
- Patent number 6,734,534
- Issue date May 11, 2004
- Intel Corporation
- Quat T. Vu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for reduced capacitance interconnect system using gaseous im...
- Patent number 6,656,822
- Issue date Dec 2, 2003
- Intel Corporation
- Brian S. Doyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated core microelectronic package
- Patent number 6,586,822
- Issue date Jul 1, 2003
- Intel Corporation
- Quat T. Vu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming microelectronic packages and intermediate struc...
- Patent number 6,586,836
- Issue date Jul 1, 2003
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to protect an encapsulated die package during back grinding...
- Patent number 6,423,570
- Issue date Jul 23, 2002
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer in interconnect system and method for bonding the cap...
- Patent number 6,388,328
- Issue date May 14, 2002
- Intel Corporation
- Brian Doyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for capacitively coupling electronic devices
- Patent number 6,310,400
- Issue date Oct 30, 2001
- Intel Corporation
- Brian Doyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for reducing interconnect system capacitance t...
- Patent number 6,303,464
- Issue date Oct 16, 2001
- Intel Corporation
- Eng T. Gaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
COF packaged semiconductor
- Patent number 6,238,954
- Issue date May 29, 2001
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect design with controlled inductance
- Patent number 6,087,728
- Issue date Jul 11, 2000
- Intel Corporation
- Quat T. Vu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cladding of an interconnect for improved electromigration performance
- Patent number 5,909,635
- Issue date Jun 1, 1999
- Intel Corporation
- Thomas Marieb
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Packaged electroosmotic pumps using porous frits for cooling integr...
- Publication number 20070278668
- Publication date Dec 6, 2007
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR WITH CARBON NANOTUBES
- Publication number 20070111460
- Publication date May 17, 2007
- Larry E. Mosley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroosmotic pumps using porous frits for cooling integrated circ...
- Publication number 20060226541
- Publication date Oct 12, 2006
- Sarah E. Kim
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
CAPACITOR WITH CARBON NANOTUBES
- Publication number 20060214262
- Publication date Sep 28, 2006
- Intel Corporation
- Larry E. Mosley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Using external radiators with electroosmotic pumps for cooling inte...
- Publication number 20060055030
- Publication date Mar 16, 2006
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroosmotic pump using nanoporous dielectric frit
- Publication number 20050104199
- Publication date May 19, 2005
- R. Scott List
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Using external radiators with electroosmotic pumps for cooling inte...
- Publication number 20050093138
- Publication date May 5, 2005
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroosmotic pumps using porous frits for cooling integrated circ...
- Publication number 20050085018
- Publication date Apr 21, 2005
- Sarah E. Kim
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Integrated re-combiner for electroosmotic pumps using porous frits
- Publication number 20050074953
- Publication date Apr 7, 2005
- Sarah E. Kim
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Microelectronic substrates with integrated devices
- Publication number 20050062173
- Publication date Mar 24, 2005
- Intel Corporation
- Quat T. Vu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaged electroosmotic pumps using porous frits for cooling integr...
- Publication number 20050062150
- Publication date Mar 24, 2005
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroosmotic pump using nanoporous dielectric frit
- Publication number 20040191943
- Publication date Sep 30, 2004
- R. Scott List
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Electro-osmotic pumps and micro-channels
- Publication number 20040120827
- Publication date Jun 24, 2004
- Sarah E. Kim
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Integrated core microelectronic package
- Publication number 20040094830
- Publication date May 20, 2004
- Intel Corporation
- Quat T. Vu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COF packaged semiconductor
- Publication number 20020185745
- Publication date Dec 12, 2002
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for packaging a microelectronic device using on-die bond pad...
- Publication number 20020173133
- Publication date Nov 21, 2002
- Intel Corporation
- Steven Towle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic device having signal distribution functionality on...
- Publication number 20020158334
- Publication date Oct 31, 2002
- Intel Corporation
- Quat T. Vu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to protect an encapsulated die package during back grinding...
- Publication number 20020127780
- Publication date Sep 12, 2002
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to protect an encapsulated die package during back grinding...
- Publication number 20020127769
- Publication date Sep 12, 2002
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCED CAPACITANCE INTERCONNECT SYSTEM USING GASEOUS IM...
- Publication number 20020090791
- Publication date Jul 11, 2002
- BRIAN S. DOYLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic package having an integrated heat sink and build-up...
- Publication number 20020070443
- Publication date Jun 13, 2002
- Xiao-Chun Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic substrates with integrated devices
- Publication number 20020020898
- Publication date Feb 21, 2002
- Quat T. Vu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Capacitively Coupling Electronic Devices
- Publication number 20010039075
- Publication date Nov 8, 2001
- Brian Doyle
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated re-combiner for electroosmotic pumps using porous frits

Method of forming a stack of heat generating integrated circuit chi...

Electroosmotic pump using nanoporous dielectric frit

Using external radiators with electroosmotic pumps for cooling inte...

Packaged electroosmotic pumps using porous frits for cooling integr...

Process for forming a direct build-up layer on an encapsulated die...

Capacitor with carbon nanotubes

Electroosmotic pumps using porous frits for cooling integrated circ...

Microelectronic substrates with integrated devices

Method for packaging a microelectronic device using on-die bond pad...

Using external radiators with electroosmotic pumps for cooling inte...

Electro-osmotic pumps and micro-channels

Method to protect an encapsulated die package during back grinding...

Method to protect an encapsulated die package during back grinding...

Microelectronic device having signal distribution functionality on...

Method of making a SDI electroosmotic pump using nanoporous dielect...

Integrated core microelectronic package

Method for capacitively coupling electronic devices

COF packaged semiconductor

Microelectronic substrate with integrated devices

Method for reduced capacitance interconnect system using gaseous im...

Integrated core microelectronic package

Process for forming microelectronic packages and intermediate struc...

Method to protect an encapsulated die package during back grinding...

Capping layer in interconnect system and method for bonding the cap...

Apparatus for capacitively coupling electronic devices

Method and structure for reducing interconnect system capacitance t...

COF packaged semiconductor

Interconnect design with controlled inductance

Cladding of an interconnect for improved electromigration performance

Patents Applicationslast 30 patents

Packaged electroosmotic pumps using porous frits for cooling integr...

CAPACITOR WITH CARBON NANOTUBES

Electroosmotic pumps using porous frits for cooling integrated circ...

CAPACITOR WITH CARBON NANOTUBES

Using external radiators with electroosmotic pumps for cooling inte...

Electroosmotic pump using nanoporous dielectric frit

Using external radiators with electroosmotic pumps for cooling inte...

Electroosmotic pumps using porous frits for cooling integrated circ...

Integrated re-combiner for electroosmotic pumps using porous frits

Microelectronic substrates with integrated devices

Packaged electroosmotic pumps using porous frits for cooling integr...

Electroosmotic pump using nanoporous dielectric frit

Electro-osmotic pumps and micro-channels

Integrated core microelectronic package

COF packaged semiconductor

Method for packaging a microelectronic device using on-die bond pad...

Microelectronic device having signal distribution functionality on...

Method to protect an encapsulated die package during back grinding...

Method to protect an encapsulated die package during back grinding...

METHOD FOR REDUCED CAPACITANCE INTERCONNECT SYSTEM USING GASEOUS IM...

Microelectronic package having an integrated heat sink and build-up...

Microelectronic substrates with integrated devices

Method for Capacitively Coupling Electronic Devices