TREA

Quintino L. Trianni

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  • Boblingen, DE
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    DEVICE FOR POSITIONING A SEMICONDUCTOR DIE IN A WAFER PROBER
    • Publication number 20210215738
    • Publication date Jul 15, 2021
    • International Business Machines Corporation
    • Otto Andreas Torreiter
    • G01 - MEASURING TESTING
  • Information Patent Application

    FUNCTIONAL TESTING OF HIGH-SPEED SERIAL LINKS
    • Publication number 20190163596
    • Publication date May 30, 2019
    • International Business Machines Corporation
    • Martin Eckert
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    CHIP ATTACH FRAME
    • Publication number 20170162534
    • Publication date Jun 8, 2017
    • International Business Machines Corporation
    • Martin Eckert
    • G01 - MEASURING TESTING
  • Information Patent Application

    AUTO-ALIGNMENT OF BACKER PLATE FOR DIRECT DOCKING TEST BOARDS
    • Publication number 20170139003
    • Publication date May 18, 2017
    • International Business Machines Corporation
    • Eberhard Dengler
    • G01 - MEASURING TESTING
  • Information Patent Application

    WAFER PROBE ALIGNMENT
    • Publication number 20170108547
    • Publication date Apr 20, 2017
    • International Business Machines Corporation
    • Joerg G. APPINGER
    • G01 - MEASURING TESTING
  • Information Patent Application

    WAFER PROBE ALIGNMENT
    • Publication number 20170108534
    • Publication date Apr 20, 2017
    • International Business Machines Corporation
    • Joerg G. APPINGER
    • G01 - MEASURING TESTING
  • Information Patent Application

    Module Testing Utilizing Wafer Probe Test Equipment
    • Publication number 20160365268
    • Publication date Dec 15, 2016
    • International Business Machines Corporation
    • Martin Eckert
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Module Testing Utilizing Wafer Probe Test Equipment
    • Publication number 20160363611
    • Publication date Dec 15, 2016
    • International Business Machines Corporation
    • Martin Eckert
    • G01 - MEASURING TESTING
  • Information Patent Application

    SOLDERING THREE DIMENSIONAL INTEGRATED CIRCUITS
    • Publication number 20160293497
    • Publication date Oct 6, 2016
    • International Business Machines Corporation
    • Martin Eckert
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SYSTEM FOR ELECTRICAL TESTING AND MANUFACTURING OF A 3-D CHIP STACK...
    • Publication number 20160097807
    • Publication date Apr 7, 2016
    • International Business Machines Corporation
    • Martin ECKERT
    • G01 - MEASURING TESTING
  • Information Patent Application

    SEMICONDUCTOR AUTOMATIC TEST EQUIPMENT
    • Publication number 20150276849
    • Publication date Oct 1, 2015
    • International Business Machines Corporation
    • Gabriele Kuczera
    • G01 - MEASURING TESTING
  • Information Patent Application

    CHIP ATTACH FRAME
    • Publication number 20150201537
    • Publication date Jul 16, 2015
    • International Business Machines Corporation
    • Martin Eckert
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CHIP ATTACH FRAME
    • Publication number 20150059166
    • Publication date Mar 5, 2015
    • International Business Machines Corporation
    • Martin Eckert
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SYSTEM FOR ELECTRICAL TESTING AND MANUFACTURING OF A 3-D CHIP STACK...
    • Publication number 20140300382
    • Publication date Oct 9, 2014
    • International Business Machines Corporation
    • Martin ECKERT
    • G01 - MEASURING TESTING
  • Information Patent Application

    CHIP ATTACH FRAME
    • Publication number 20130207250
    • Publication date Aug 15, 2013
    • International Business Machines Corporation
    • Martin Eckert
    • G01 - MEASURING TESTING