Qwan Ho Chung

Person

Kyoungki-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical characteristics of package substrates and semiconductor...
- Patent number 9,609,742
- Issue date Mar 28, 2017
- SK hynix Inc.
- Eul Chul Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 9,412,716
- Issue date Aug 9, 2016
- SK hynix Inc.
- Jin Ho Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having EMI shielding and method of fabricatin...
- Patent number 9,368,456
- Issue date Jun 14, 2016
- SK Hynix Inc.
- Qwan Ho Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates having ball lands, semiconductor packages including the...
- Patent number 9,305,895
- Issue date Apr 5, 2016
- SK Hynix Inc.
- Jong Woo Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package stacked device
- Patent number 9,252,136
- Issue date Feb 2, 2016
- SK Hynix Inc.
- Seung Jee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages having bumps and methods of manufacturin...
- Patent number 9,209,146
- Issue date Dec 8, 2015
- SK Hynix Inc.
- Seung Jee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded packages, methods of fabricating the same, electronic syst...
- Patent number 9,209,150
- Issue date Dec 8, 2015
- SK Hynix Inc.
- Sang Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package and method for manufacturing the same
- Patent number 9,111,820
- Issue date Aug 18, 2015
- SK Hynix Inc.
- Qwan Ho Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages having bumps and methods of manufacturin...
- Patent number 8,907,487
- Issue date Dec 9, 2014
- SK Hynix Inc.
- Seung Jee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump for semiconductor package, semiconductor package having bump,...
- Patent number 8,823,183
- Issue date Sep 2, 2014
- SK Hynix Inc.
- Ki Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack type semiconductor package
- Patent number 8,796,834
- Issue date Aug 5, 2014
- SK Hynix Inc.
- Jin Ho Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package and method for manufacturing the same
- Patent number 8,710,652
- Issue date Apr 29, 2014
- SK Hynix Inc.
- Qwan Ho Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for semiconductor package, semiconductor package includin...
- Patent number 8,461,696
- Issue date Jun 11, 2013
- Hynix Semiconductor Inc.
- Kyu Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 8,445,322
- Issue date May 21, 2013
- SK Hynix Inc.
- Woong Sun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having substrate for high speed semiconductor...
- Patent number 8,441,116
- Issue date May 14, 2013
- Hynix Semiconductor Inc.
- Woong Sun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for discharging heat and method for fabricati...
- Patent number 8,399,294
- Issue date Mar 19, 2013
- Hynix Semiconductor Inc.
- Qwan Ho Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lightweight and compact through-silicon via stack package with exce...
- Patent number 8,343,803
- Issue date Jan 1, 2013
- Hynix Semiconductor Inc.
- Qwan Ho Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for discharging heat and method for fabricati...
- Patent number 8,264,087
- Issue date Sep 11, 2012
- Hynix Semiconductor Inc.
- Qwan Ho Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having semiconductor chip
- Patent number 8,129,627
- Issue date Mar 6, 2012
- Hynix Semiconductor Inc.
- Woong Sun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor package and method for fabricating the same
- Patent number 8,053,879
- Issue date Nov 8, 2011
- Hynix Semiconductor Inc.
- Woong Sun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having chip selection through electrodes and...
- Patent number 8,030,739
- Issue date Oct 4, 2011
- Hynix Semiconductor Inc.
- Qwan Ho Chung
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and semiconductor package having the same
- Patent number 7,928,535
- Issue date Apr 19, 2011
- Hynix Semiconductor Inc.
- Yeo Song Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved size, reliability, warpage prev...
- Patent number 7,858,520
- Issue date Dec 28, 2010
- Hynix Semiconductor Inc.
- Qwan Ho Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package having the same
- Patent number 7,855,437
- Issue date Dec 21, 2010
- Hynix Semiconductor Inc.
- Yeo Song Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lightweight and compact through-silicon via stack package with exce...
- Patent number 7,847,379
- Issue date Dec 7, 2010
- Hynix Semiconductor Inc.
- Qwan Ho Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved size, reliability, warpage prev...
- Patent number 7,786,590
- Issue date Aug 31, 2010
- Hynix Semiconductor Inc.
- Qwan Ho Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package having the same
- Patent number 7,755,170
- Issue date Jul 13, 2010
- Hynix Semiconductor Inc.
- Yeo Song Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package configured to compensate size difference in dif...
- Patent number 7,629,682
- Issue date Dec 8, 2009
- Hynix Semiconductor Inc.
- Seung Taek Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package in which semiconductor packages are c...
- Patent number 7,595,552
- Issue date Sep 29, 2009
- Hynix Semiconductor Inc.
- Qwan Ho Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and method for fabricating the same
- Patent number 7,445,961
- Issue date Nov 4, 2008
- Hynix Semiconductor Inc.
- Qwan Ho Chung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STACKED DEVICE
- Publication number 20150287702
- Publication date Oct 8, 2015
- SK HYNIX INC.
- Seung Jee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING AND METHOD OF FABRICATIN...
- Publication number 20150187705
- Publication date Jul 2, 2015
- SK HYNIX INC.
- Qwan Ho CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES HAVING BALL LANDS, SEMICONDUCTOR PACKAGES INCLUDING THE...
- Publication number 20150145131
- Publication date May 28, 2015
- SK HYNIX INC.
- Jong Woo YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150123283
- Publication date May 7, 2015
- SK HYNIX INC.
- Jin Ho BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...
- Publication number 20150056755
- Publication date Feb 26, 2015
- SK HYNIX INC.
- Seung Jee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGES, METHODS OF FABRICATING THE SAME, ELECTRONIC SYST...
- Publication number 20140367851
- Publication date Dec 18, 2014
- SK HYNIX INC.
- Sang Yong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140291837
- Publication date Oct 2, 2014
- SK HYNIX INC.
- Qwan Ho CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CHARACTERISTICS OF PACKAGE SUBSTRATES AND SEMICONDUCTOR...
- Publication number 20140175680
- Publication date Jun 26, 2014
- SK HYNIX INC.
- Eul Chul JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20130334685
- Publication date Dec 19, 2013
- SK HYNIX INC.
- Si Han KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...
- Publication number 20130334683
- Publication date Dec 19, 2013
- SK HYNIX INC.
- Seung Jee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20130236993
- Publication date Sep 12, 2013
- SK HYNIX INC.
- Woong Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTWEIGHT AND COMPACT THROUGH-SILICON VIA STACK PACKAGE WITH EXCE...
- Publication number 20130087919
- Publication date Apr 11, 2013
- Hynix Semiconductor Inc.
- Qwan Ho CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130037938
- Publication date Feb 14, 2013
- Hynix Semiconductor Inc.
- Qwan Ho CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR DISCHARGING HEAT AND METHOD FOR FABRICATI...
- Publication number 20120309129
- Publication date Dec 6, 2012
- Qwan Ho CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR HIGH SPEED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PA...
- Publication number 20120217637
- Publication date Aug 30, 2012
- Hynix Semiconductor Inc.
- Woong Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120208325
- Publication date Aug 16, 2012
- Hynix Semiconductor Inc.
- Qwan Ho CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR PACKAGE
- Publication number 20120112342
- Publication date May 10, 2012
- Hynix Semiconductor Inc.
- Sung Ho HYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE HAVING BUMP,...
- Publication number 20120091584
- Publication date Apr 19, 2012
- Hynix Semiconductor Inc.
- Ki Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20120015477
- Publication date Jan 19, 2012
- Woong Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE
- Publication number 20110309504
- Publication date Dec 22, 2011
- Hynix Semiconductor Inc.
- Jin Ho BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20110057328
- Publication date Mar 10, 2011
- Hynix Semiconductor Inc.
- Yeo Song YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTWEIGHT AND COMPACT THROUGH-SILICON VIA STACK PACKAGE WITH EXCE...
- Publication number 20110045636
- Publication date Feb 24, 2011
- Hynix Semiconductor Inc.
- Qwan Ho CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE THAT PREVENTS WARPING AND CRACKING OF A WAFER AND SEM...
- Publication number 20110033980
- Publication date Feb 10, 2011
- Hynix Semiconductor Inc.
- Qwan Ho CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INCLUDIN...
- Publication number 20110006413
- Publication date Jan 13, 2011
- Hynix Semiconductor Inc.
- Kyu Won LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD HAVING SEMICONDUCTOR CHIP
- Publication number 20100326715
- Publication date Dec 30, 2010
- Hynix Semiconductor Inc.
- Woong Sun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED SIZE, RELIABILITY, WARPAGE PREV...
- Publication number 20100291733
- Publication date Nov 18, 2010
- Hynix Semiconductor Inc.
- Qwan Ho CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20100237473
- Publication date Sep 23, 2010
- Hynix Semiconductor Inc.
- Yeo Song YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR DISCHARGING HEAT AND METHOD FOR FABRICATI...
- Publication number 20100090335
- Publication date Apr 15, 2010
- Qwan Ho CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20100052187
- Publication date Mar 4, 2010
- Woong Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING CHIP SELECTION THROUGH ELECTRODES AND...
- Publication number 20090267208
- Publication date Oct 29, 2009
- Qwan Ho CHUNG
- G11 - INFORMATION STORAGE

Qwan Ho Chung

Person

Patents Grantslast 30 patents

Electrical characteristics of package substrates and semiconductor...

Semiconductor package and method for manufacturing the same

Semiconductor package having EMI shielding and method of fabricatin...

Substrates having ball lands, semiconductor packages including the...

Package stacked device

Electronic device packages having bumps and methods of manufacturin...

Embedded packages, methods of fabricating the same, electronic syst...

Embedded package and method for manufacturing the same

Electronic device packages having bumps and methods of manufacturin...

Bump for semiconductor package, semiconductor package having bump,...

Stack type semiconductor package

Embedded package and method for manufacturing the same

Substrate for semiconductor package, semiconductor package includin...

Method of fabricating semiconductor package

Semiconductor package having substrate for high speed semiconductor...

Semiconductor package for discharging heat and method for fabricati...

Lightweight and compact through-silicon via stack package with exce...

Semiconductor package for discharging heat and method for fabricati...

Circuit board having semiconductor chip

Stacked semiconductor package and method for fabricating the same

Semiconductor package having chip selection through electrodes and...

Semiconductor device and semiconductor package having the same

Semiconductor package with improved size, reliability, warpage prev...

Semiconductor device and semiconductor package having the same

Lightweight and compact through-silicon via stack package with exce...

Semiconductor package with improved size, reliability, warpage prev...

Semiconductor device and semiconductor package having the same

Wafer level package configured to compensate size difference in dif...

Stacked semiconductor package in which semiconductor packages are c...

Semiconductor chip package and method for fabricating the same

Patents Applicationslast 30 patents

PACKAGE STACKED DEVICE

SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING AND METHOD OF FABRICATIN...

SUBSTRATES HAVING BALL LANDS, SEMICONDUCTOR PACKAGES INCLUDING THE...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...

EMBEDDED PACKAGES, METHODS OF FABRICATING THE SAME, ELECTRONIC SYST...

EMBEDDED PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRICAL CHARACTERISTICS OF PACKAGE SUBSTRATES AND SEMICONDUCTOR...

EMBEDDED PACKAGES AND METHODS OF MANUFACTURING THE SAME

ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

LIGHTWEIGHT AND COMPACT THROUGH-SILICON VIA STACK PACKAGE WITH EXCE...

EMBEDDED PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE FOR DISCHARGING HEAT AND METHOD FOR FABRICATI...

SUBSTRATE FOR HIGH SPEED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PA...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR PACKAGE

BUMP FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE HAVING BUMP,...

STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

STACK PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

LIGHTWEIGHT AND COMPACT THROUGH-SILICON VIA STACK PACKAGE WITH EXCE...

STACK PACKAGE THAT PREVENTS WARPING AND CRACKING OF A WAFER AND SEM...

SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INCLUDIN...

CIRCUIT BOARD HAVING SEMICONDUCTOR CHIP

SEMICONDUCTOR PACKAGE WITH IMPROVED SIZE, RELIABILITY, WARPAGE PREV...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

SEMICONDUCTOR PACKAGE FOR DISCHARGING HEAT AND METHOD FOR FABRICATI...

STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE HAVING CHIP SELECTION THROUGH ELECTRODES AND...