R. RICHARD STEINER

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UNIVERSITY HEIGHTS, OH, US

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Patents Grantslast 30 patents

Information Patent Grant
Resin/copper/metal laminate and method of producing same
- Patent number 6,770,380
- Issue date Aug 3, 2004
- Nikko Materials USA, Inc.
- R. Richard Steiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Corrosion prevention for CAC component
- Patent number 6,673,471
- Issue date Jan 6, 2004
- Nikko Materials USA, Inc.
- R. Richard Steiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component of printed circuit board
- Patent number 6,379,487
- Issue date Apr 30, 2002
- GA-TEK Inc.
- Bernd Schneider
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin/copper/metal laminate and method of producing same
- Patent number 6,376,008
- Issue date Apr 23, 2002
- Gould Electronics Inc.
- R. Richard Steiner
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Component of printed circuit boards
- Publication number 20030017357
- Publication date Jan 23, 2003
- Gould Electronics Inc.
- R. Richard Steiner
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Corrosion prevention for CAC component
- Publication number 20020119342
- Publication date Aug 29, 2002
- GA-TEK Inc. (dba Gould Electronics Inc.)
- R. Richard Steiner
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN/COPPER/METAL LAMINATE AND METHOD OF PRODUCING SAME
- Publication number 20020061415
- Publication date May 23, 2002
- R. RICHARD STEINER
- B32 - LAYERED PRODUCTS