Rabindra N. Das

Person

Lexington, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Superconducting integrated circuit
- Patent number 10,658,424
- Issue date May 19, 2020
- Massachusetts Institute of Technology
- William D. Oliver
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cryogenic electronic packages and assemblies
- Patent number 10,586,909
- Issue date Mar 10, 2020
- Massachusetts Institute of Technology
- Rabindra N. Das
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structures for assembly in multi-layer semiconductor...
- Patent number 10,418,350
- Issue date Sep 17, 2019
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for assembly of semiconductor structures in...
- Patent number 10,396,269
- Issue date Aug 27, 2019
- Massachusetts Institute of Technology
- William D. Oliver
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Cryogenic electronic packages and methods for fabricating cryogenic...
- Patent number 10,381,541
- Issue date Aug 13, 2019
- Massachusetts Institute of Technology
- Rabindra N. Das
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect structure and semiconductor structures for assembly of...
- Patent number 10,242,968
- Issue date Mar 26, 2019
- Massachusetts Institute of Technology
- Rabindra N. Das
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-layer semiconductor structure and methods for fabricating mul...
- Patent number 10,229,897
- Issue date Mar 12, 2019
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded through via structures and methods for fabricating shielde...
- Patent number 10,199,553
- Issue date Feb 5, 2019
- Massachusetts Institute of Technology
- William D. Oliver
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Qubit and coupler circuit structures and coupling techniques
- Patent number 10,134,972
- Issue date Nov 20, 2018
- Massachusetts Institute of Technology
- William D. Oliver
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect structures and methods for fabricating interconnect st...
- Patent number 10,121,754
- Issue date Nov 6, 2018
- Massachusetts Institute of Technology
- William D. Oliver
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect structures for assembly of semiconductor structures in...
- Patent number 10,079,224
- Issue date Sep 18, 2018
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer semiconductor devices fabricated using a combination of...
- Patent number 9,881,904
- Issue date Jan 30, 2018
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for assembly of multi-layer semiconductor d...
- Patent number 9,812,429
- Issue date Nov 7, 2017
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for fine pitch assembly of semiconductor st...
- Patent number 9,786,633
- Issue date Oct 10, 2017
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for assembly of multi-layer semiconductor d...
- Patent number 9,780,075
- Issue date Oct 3, 2017
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Active Wafer-Scale Reconfigurable Logic Fabric for AI and High-Perf...
- Publication number 20250159983
- Publication date May 15, 2025
- Massachusetts Institute of Technology
- Brian Tyrrell
Information Patent Application
Superconducting Integrated Circuit
- Publication number 20180247974
- Publication date Aug 30, 2018
- Massachusetts Institute of Technology
- William D. Oliver
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CRYOGENIC ELECTRONIC PACKAGES AND ASSEMBLIES
- Publication number 20180102470
- Publication date Apr 12, 2018
- Massachusetts Institute of Technology
- Rabindra N. Das
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CRYOGENIC ELECTRONIC PACKAGES AND METHODS FOR FABRICATING CRYOGENIC...
- Publication number 20180102469
- Publication date Apr 12, 2018
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR ASSEMBLY OF SEMICONDUCTOR STRUCTURES IN...
- Publication number 20180012932
- Publication date Jan 11, 2018
- Massachusetts Institute of Technology
- William D. Oliver
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Qubit and Coupler Circuit Structures and Coupling Techniques
- Publication number 20180013052
- Publication date Jan 11, 2018
- Massachusetts Institute of Technology
- William D. Oliver
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECT STRUCTURES AND SEMICONDUCTOR STRUCTURES FOR ASSEMBLY O...
- Publication number 20170373044
- Publication date Dec 28, 2017
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures for Assembly of Multi-Layer Semiconductor D...
- Publication number 20170200700
- Publication date Jul 13, 2017
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Semiconductor Structure and Methods for Fabricating Mul...
- Publication number 20170194248
- Publication date Jul 6, 2017
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures For Assembly Of Semiconductor Structures In...
- Publication number 20170162550
- Publication date Jun 8, 2017
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structures For Assembly In Multi-Layer Semiconductor...
- Publication number 20170162507
- Publication date Jun 8, 2017
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS FOR FABRICATING INTERCONNECT ST...
- Publication number 20170133336
- Publication date May 11, 2017
- Massachusetts Institute of Technology
- William D. Oliver
- B82 - NANO-TECHNOLOGY
Information Patent Application
INTERCONNECT STRUCTURES FOR FINE PITCH ASSEMBLY OF SEMICONDUCTOR ST...
- Publication number 20170098627
- Publication date Apr 6, 2017
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures for Assembly of Multi-Layer Semiconductor D...
- Publication number 20170092621
- Publication date Mar 30, 2017
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Semiconductor Devices Fabricated Using a Combination of...
- Publication number 20170040296
- Publication date Feb 9, 2017
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS

Rabindra N. Das

Person

Patents Grantslast 30 patents

Superconducting integrated circuit

Cryogenic electronic packages and assemblies

Semiconductor structures for assembly in multi-layer semiconductor...

Interconnect structures for assembly of semiconductor structures in...

Cryogenic electronic packages and methods for fabricating cryogenic...

Interconnect structure and semiconductor structures for assembly of...

Multi-layer semiconductor structure and methods for fabricating mul...

Shielded through via structures and methods for fabricating shielde...

Qubit and coupler circuit structures and coupling techniques

Interconnect structures and methods for fabricating interconnect st...

Interconnect structures for assembly of semiconductor structures in...

Multi-layer semiconductor devices fabricated using a combination of...

Interconnect structures for assembly of multi-layer semiconductor d...

Interconnect structures for fine pitch assembly of semiconductor st...

Interconnect structures for assembly of multi-layer semiconductor d...

Patents Applicationslast 30 patents

Active Wafer-Scale Reconfigurable Logic Fabric for AI and High-Perf...

Superconducting Integrated Circuit

CRYOGENIC ELECTRONIC PACKAGES AND ASSEMBLIES

CRYOGENIC ELECTRONIC PACKAGES AND METHODS FOR FABRICATING CRYOGENIC...

INTERCONNECT STRUCTURES FOR ASSEMBLY OF SEMICONDUCTOR STRUCTURES IN...

Qubit and Coupler Circuit Structures and Coupling Techniques

INTERCONNECT STRUCTURES AND SEMICONDUCTOR STRUCTURES FOR ASSEMBLY O...

Interconnect Structures for Assembly of Multi-Layer Semiconductor D...

Multi-Layer Semiconductor Structure and Methods for Fabricating Mul...

Interconnect Structures For Assembly Of Semiconductor Structures In...

Semiconductor Structures For Assembly In Multi-Layer Semiconductor...

INTERCONNECT STRUCTURES AND METHODS FOR FABRICATING INTERCONNECT ST...

INTERCONNECT STRUCTURES FOR FINE PITCH ASSEMBLY OF SEMICONDUCTOR ST...

Interconnect Structures for Assembly of Multi-Layer Semiconductor D...

Multi-Layer Semiconductor Devices Fabricated Using a Combination of...