Raffaele Coppeta

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with through-substrate via
- Patent number 11,367,672
- Issue date Jun 21, 2022
- ams AG
- Jochen Kraft
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device and semiconductor d...
- Patent number 11,355,386
- Issue date Jun 7, 2022
- ams AG
- Georg Parteder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack-resistant semiconductor devices
- Patent number 11,127,656
- Issue date Sep 21, 2021
- ams AG
- Jochen Kraft
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR D...
- Publication number 20210366764
- Publication date Nov 25, 2021
- ams AG
- Georg Parteder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA
- Publication number 20210175153
- Publication date Jun 10, 2021
- ams AG
- Jochen KRAFT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20200020611
- Publication date Jan 16, 2020
- ams AG
- Jochen Kraft
- H01 - BASIC ELECTRIC ELEMENTS