Raghunandan Ramesh Chaware

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Huntington Beach, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Process for exposing solder bumps on an underfill coated semiconductor
- Patent number 7,338,842
- Issue date Mar 4, 2008
- National Starch and Chemical Investment Holding Corporation
- Raghunandan Chaware
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Process for exposing solder bumps on an underfill coated semiconductor
- Publication number 20070020815
- Publication date Jan 25, 2007
- Raghunandan Chaware
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hot-Melt Underfill Composition and Methos of Application
- Publication number 20060134901
- Publication date Jun 22, 2006
- National Starch and Chemical Investment Holding Corporation
- Raghunandan Ramesh Chaware
- H01 - BASIC ELECTRIC ELEMENTS