Raghuveer R. Patlolla

Person

Guilderland, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Maskless alignment scheme for BEOL memory array manufacturing
- Patent number 12,107,008
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Soon-Cheon Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure with double conductors
- Patent number 12,087,685
- Issue date Sep 10, 2024
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface conversion in chemical mechanical polishing
- Patent number 11,804,378
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Raghuveer R Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene with short liner
- Patent number 11,664,271
- Issue date May 30, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization stop region for use with low pattern density intercon...
- Patent number 11,637,036
- Issue date Apr 25, 2023
- International Business Machines Corporation
- Cornelius Brown Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner and cap structures for reducing local interconnect vertical r...
- Patent number 11,205,587
- Issue date Dec 21, 2021
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect and memory structures having reduced topography variat...
- Patent number 11,164,878
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controllable formation of recessed bottom electrode contact in a me...
- Patent number 11,133,457
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Raghuveer Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet clean solutions to prevent pattern collapse
- Patent number 11,094,527
- Issue date Aug 17, 2021
- International Business Machines Corporation
- Cornelius B. Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming dual metallization interconnect structures in single metall...
- Patent number 11,037,875
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Hari P. Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization of dielectric topography and stopping in dielectric
- Patent number 11,037,795
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnects
- Patent number 11,031,339
- Issue date Jun 8, 2021
- International Business Machines Corporation
- Raghuveer R. Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures of more uniform thickness
- Patent number 11,031,250
- Issue date Jun 8, 2021
- International Business Machines Corporation
- Mona A. Ebrish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming dual metallization interconnect structures in single metall...
- Patent number 11,031,337
- Issue date Jun 8, 2021
- International Business Machines Corporation
- Hari P. Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnects
- Patent number 11,018,087
- Issue date May 25, 2021
- International Business Machines Corporation
- Raghuveer R. Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust gate cap for protecting a gate from downstream metallization...
- Patent number 10,916,431
- Issue date Feb 9, 2021
- International Business Machines Corporation
- Raghuveer Reddy Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back end of line metallization structure
- Patent number 10,910,307
- Issue date Feb 2, 2021
- International Business Machines Corporation
- Raghuveer R. Patlolla
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Back end of line metallization structure
- Patent number 10,903,161
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Raghuveer R. Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling performance and reliability of conductive regions in a...
- Patent number 10,896,846
- Issue date Jan 19, 2021
- International Business Machines Corporation
- Raghuveer Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom electrode and dielectric structure for MRAM applications
- Patent number 10,833,122
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low oxygen cleaning for CMP equipment
- Patent number 10,832,917
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Donald F. Canaperi
- B08 - CLEANING
Information Patent Grant
Semiconductor interconnect structure with double conductors
- Patent number 10,804,193
- Issue date Oct 13, 2020
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back end of line metallization structures
- Patent number 10,741,748
- Issue date Aug 11, 2020
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling performance and reliability of conductive regions in a...
- Patent number 10,714,382
- Issue date Jul 14, 2020
- International Business Machines Corporation
- Raghuveer Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back end of line integration for interconnects
- Patent number 10,699,945
- Issue date Jun 30, 2020
- International Business Machines Corporation
- Cornelius B. Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner and cap structures for reducing local interconnect vertical r...
- Patent number 10,685,876
- Issue date Jun 16, 2020
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back end of line metallization structures
- Patent number 10,686,126
- Issue date Jun 16, 2020
- International Business Machiness Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low aspect ratio interconnect
- Patent number 10,672,707
- Issue date Jun 2, 2020
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming dual metallization interconnect structures in single metall...
- Patent number 10,559,530
- Issue date Feb 11, 2020
- International Business Machines Corporation
- Hari P. Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom electrode for MRAM applications
- Patent number 10,461,248
- Issue date Oct 29, 2019
- International Business Machines Corporation
- Prasad Bhosale
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS
- Publication number 20240395702
- Publication date Nov 28, 2024
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUB-EUV PATTERNING HEATERS FOR BAR MUSHROOM CELL PCM
- Publication number 20240090353
- Publication date Mar 14, 2024
- International Business Machines Corporation
- Samuel Sung Shik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE CONVERSION IN CHEMICAL MECHANICAL POLISHING
- Publication number 20230215734
- Publication date Jul 6, 2023
- International Business Machines Corporation
- Raghuveer R. Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC PLANARIZATION USING A METAL OVERBURDEN WITH ETCH-STOP LA...
- Publication number 20230187274
- Publication date Jun 15, 2023
- International Business Machines Corporation
- Raghuveer Reddy Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-DAMASCENE INTERCONNECT HAVING CONTROL OVER CORROSION, DIELEC...
- Publication number 20230170294
- Publication date Jun 1, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKLESS ALIGNMENT SCHEME FOR BEOL MEMORY ARRAY MANUFACTURING
- Publication number 20230145961
- Publication date May 11, 2023
- International Business Machines Corporation
- Soon-Cheon Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT AND MEMORY STRUCTURES HAVING REDUCED TOPOGRAPHY VARIAT...
- Publication number 20210242216
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION STOP REGION FOR USE WITH LOW PATTERN DENSITY INTERCON...
- Publication number 20210242077
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Cornelius Brown Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METALLIZATION AND DIELECTRIC INTERCONNECTS IN TOP VIA CONFIG...
- Publication number 20210143061
- Publication date May 13, 2021
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLABLE FORMATION OF RECESSED BOTTOM ELECTRODE CONTACT IN A ME...
- Publication number 20210091303
- Publication date Mar 25, 2021
- International Business Machines Corporation
- Raghuveer PATLOLLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS
- Publication number 20210043563
- Publication date Feb 11, 2021
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Planarization of Dielectric Topography and Stopping in Dielectric
- Publication number 20210035813
- Publication date Feb 4, 2021
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER METALLIZATION FILL
- Publication number 20200350201
- Publication date Nov 5, 2020
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBUST GATE CAP FOR PROTECTING A GATE FROM DOWNSTREAM METALLIZATION...
- Publication number 20200335345
- Publication date Oct 22, 2020
- International Business Machines Corporation
- Raghuveer Reddy Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW ASPECT RATIO INTERCONNECT
- Publication number 20200328156
- Publication date Oct 15, 2020
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Interconnect Structures with Self-Forming Sidewall Barrier Layer
- Publication number 20200294911
- Publication date Sep 17, 2020
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM ELECTRODE AND DIELECTRIC STRUCTURE FOR MRAM APPLICATIONS
- Publication number 20200219931
- Publication date Jul 9, 2020
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE INTEGRATION FOR INTERCONNECTS
- Publication number 20200219759
- Publication date Jul 9, 2020
- International Business Machines Corporation
- Cornelius B. Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES OF MORE UNIFORM THICKNESS
- Publication number 20200176263
- Publication date Jun 4, 2020
- International Business Machines Corporation
- Mona A. Ebrish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE METALLIZATION STRUCTURE
- Publication number 20200144178
- Publication date May 7, 2020
- International Business Machines Corporation
- Raghuveer R. Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE METALLIZATION STRUCTURE
- Publication number 20200144180
- Publication date May 7, 2020
- International Business Machines Corporation
- Raghuveer R. Patlolla
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CONTROLLING PERFORMANCE AND RELIABILITY OF CONDUCTIVE REGIONS IN A...
- Publication number 20200118866
- Publication date Apr 16, 2020
- International Business Machines Corporation
- Raghuveer Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING PERFORMANCE AND RELIABILITY OF CONDUCTIVE REGIONS IN A...
- Publication number 20200118865
- Publication date Apr 16, 2020
- International Business Machines Corporation
- Raghuveer Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET CLEAN SOLUTIONS TO PREVENT PATTERN COLLAPSE
- Publication number 20200118808
- Publication date Apr 16, 2020
- International Business Machines Corporation
- Cornelius B. Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE INTEGRATION FOR INTERCONNECTS
- Publication number 20200111699
- Publication date Apr 9, 2020
- International Business Machines Corporation
- Cornelius B. Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER AND CAP STRUCTURES FOR REDUCING LOCAL INTERCONNECT VERTICAL R...
- Publication number 20200090990
- Publication date Mar 19, 2020
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER AND CAP STRUCTURES FOR REDUCING LOCAL INTERCONNECT VERTICAL R...
- Publication number 20200090989
- Publication date Mar 19, 2020
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECTS
- Publication number 20200083169
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Raghuveer R. Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE METALLIZATION STRUCTURES
- Publication number 20200083435
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE METALLIZATION STRUCTURES
- Publication number 20190393409
- Publication date Dec 26, 2019
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS

Raghuveer R. Patlolla

Person

Patents Grantslast 30 patents

Maskless alignment scheme for BEOL memory array manufacturing

Semiconductor interconnect structure with double conductors

Surface conversion in chemical mechanical polishing

Dual damascene with short liner

Planarization stop region for use with low pattern density intercon...

Liner and cap structures for reducing local interconnect vertical r...

Interconnect and memory structures having reduced topography variat...

Controllable formation of recessed bottom electrode contact in a me...

Wet clean solutions to prevent pattern collapse

Forming dual metallization interconnect structures in single metall...

Planarization of dielectric topography and stopping in dielectric

Metal interconnects

Semiconductor structures of more uniform thickness

Forming dual metallization interconnect structures in single metall...

Metal interconnects

Robust gate cap for protecting a gate from downstream metallization...

Back end of line metallization structure

Back end of line metallization structure

Controlling performance and reliability of conductive regions in a...

Bottom electrode and dielectric structure for MRAM applications

Low oxygen cleaning for CMP equipment

Semiconductor interconnect structure with double conductors

Back end of line metallization structures

Controlling performance and reliability of conductive regions in a...

Back end of line integration for interconnects

Liner and cap structures for reducing local interconnect vertical r...

Back end of line metallization structures

Low aspect ratio interconnect

Forming dual metallization interconnect structures in single metall...

Bottom electrode for MRAM applications

Patents Applicationslast 30 patents

SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS

SUB-EUV PATTERNING HEATERS FOR BAR MUSHROOM CELL PCM

SURFACE CONVERSION IN CHEMICAL MECHANICAL POLISHING

DIELECTRIC PLANARIZATION USING A METAL OVERBURDEN WITH ETCH-STOP LA...

SINGLE-DAMASCENE INTERCONNECT HAVING CONTROL OVER CORROSION, DIELEC...

MASKLESS ALIGNMENT SCHEME FOR BEOL MEMORY ARRAY MANUFACTURING

INTERCONNECT AND MEMORY STRUCTURES HAVING REDUCED TOPOGRAPHY VARIAT...

PLANARIZATION STOP REGION FOR USE WITH LOW PATTERN DENSITY INTERCON...

HYBRID METALLIZATION AND DIELECTRIC INTERCONNECTS IN TOP VIA CONFIG...

CONTROLLABLE FORMATION OF RECESSED BOTTOM ELECTRODE CONTACT IN A ME...

SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS

Planarization of Dielectric Topography and Stopping in Dielectric

COPPER METALLIZATION FILL

ROBUST GATE CAP FOR PROTECTING A GATE FROM DOWNSTREAM METALLIZATION...

LOW ASPECT RATIO INTERCONNECT

Metal Interconnect Structures with Self-Forming Sidewall Barrier Layer

BOTTOM ELECTRODE AND DIELECTRIC STRUCTURE FOR MRAM APPLICATIONS

BACK END OF LINE INTEGRATION FOR INTERCONNECTS

SEMICONDUCTOR STRUCTURES OF MORE UNIFORM THICKNESS

BACK END OF LINE METALLIZATION STRUCTURE

BACK END OF LINE METALLIZATION STRUCTURE

CONTROLLING PERFORMANCE AND RELIABILITY OF CONDUCTIVE REGIONS IN A...

CONTROLLING PERFORMANCE AND RELIABILITY OF CONDUCTIVE REGIONS IN A...

WET CLEAN SOLUTIONS TO PREVENT PATTERN COLLAPSE

BACK END OF LINE INTEGRATION FOR INTERCONNECTS

LINER AND CAP STRUCTURES FOR REDUCING LOCAL INTERCONNECT VERTICAL R...

LINER AND CAP STRUCTURES FOR REDUCING LOCAL INTERCONNECT VERTICAL R...

METAL INTERCONNECTS

BACK END OF LINE METALLIZATION STRUCTURES

BACK END OF LINE METALLIZATION STRUCTURES