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last 30 patents
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Patent Grant
Subscriber identity module (SIM) card
Patent number
8,544,755
Issue date
Oct 1, 2013
United Test & Assembly Center Ltd.
Rahamat Bidin
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Multi-die IC package and manufacturing method
Patent number
7,816,775
Issue date
Oct 19, 2010
United Test & Assembly Center Limited
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe based chip scale package and method of producing the same
Patent number
6,420,779
Issue date
Jul 16, 2002
ST Assembly Test Services Ltd.
Nirmal K. Sharma
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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SUBSCRIBER IDENTITY MODULE (SIM) CARD
Publication number
20110315779
Publication date
Dec 29, 2011
United Test & Assembly Center Ltd.
Rahamat Bidin
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Chip Scale Package and Method of Assembling the Same
Publication number
20080290509
Publication date
Nov 27, 2008
UNITED TEST AND ASSEMBLY CENTER
Hien Boon Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-Die Ic Package and Manufacturing Method
Publication number
20080150103
Publication date
Jun 26, 2008
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS