Rahim Kasim

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Portland, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Selective metal removal for conductive interconnects in integrated...
- Patent number 12,176,214
- Issue date Dec 24, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cladded metal interconnects
- Patent number 11,749,560
- Issue date Sep 5, 2023
- Intel Corporation
- Thomas Marieb
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective metal removal for conductive interconnects in integrated...
- Patent number 11,158,515
- Issue date Oct 26, 2021
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACKSIDE CONTACT BASED DIE EDGE GUARD RINGS
- Publication number 20240421101
- Publication date Dec 19, 2024
- Intel Corporation
- Sunny CHUGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA DIE
- Publication number 20240363490
- Publication date Oct 31, 2024
- Intel Corporation
- Mohammad Enamul KABIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE METAL REMOVAL FOR CONDUCTIVE INTERCONNECTS IN INTEGRATED...
- Publication number 20220051896
- Publication date Feb 17, 2022
- Intel Corporation
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE METAL REMOVAL FOR CONDUCTIVE INTERCONNECTS IN INTEGRATED...
- Publication number 20200185226
- Publication date Jun 11, 2020
- Intel Corporation
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLADDED METAL INTERCONNECTS
- Publication number 20200098619
- Publication date Mar 26, 2020
- Intel Corporation
- Thomas Marieb
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...