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Rahul Agarwal
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Low temperature hybrid bonding
Patent number
11,911,839
Issue date
Feb 27, 2024
Advanced Micro Devices, Inc.
Priyal Shah
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Offset-aligned three-dimensional integrated circuit
Patent number
11,855,061
Issue date
Dec 26, 2023
Advanced Micro Devices, Inc.
Brett P. Wilkerson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
GPU chiplets using high bandwidth crosslinks
Patent number
11,841,803
Issue date
Dec 12, 2023
Advanced Micro Devices, Inc.
Skyler J. Saleh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Circuit board with compact passive component arrangement
Patent number
11,837,588
Issue date
Dec 5, 2023
Advanced Micro Devices, Inc.
Milind S. Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Creating interconnects between dies using a cross-over die and thro...
Patent number
11,830,817
Issue date
Nov 28, 2023
Advanced Micro Devices, Inc.
Rahul Agarwal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Scheme for enabling die reuse in 3D stacked products
Patent number
11,804,479
Issue date
Oct 31, 2023
Advanced Micro Devices, Inc.
John J. Wuu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-speed die connections using a conductive insert
Patent number
11,749,629
Issue date
Sep 5, 2023
Advanced Micro Devices, Inc.
Rahul Agarwal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out package with reinforcing rivets
Patent number
11,742,301
Issue date
Aug 29, 2023
Advanced Micro Devices, Inc.
Rahul Agarwal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package with integrated voltage regulator
Patent number
11,715,691
Issue date
Aug 1, 2023
Advanced Micro Devices, Inc.
Milind S. Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fanout module integrating a photonic integrated circuit
Patent number
11,709,327
Issue date
Jul 25, 2023
Advanced Micro Devices, Inc.
Brett P. Wilkerson
G02 - OPTICS
Information
Patent Grant
Hybrid bonded interconnect bridging
Patent number
11,676,940
Issue date
Jun 13, 2023
Advanced Micro Devices, Inc.
Lei Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit module with integrated discrete devices
Patent number
11,670,624
Issue date
Jun 6, 2023
Advanced Micro Devices, Inc.
Milind S. Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid bridged fanout chiplet connectivity
Patent number
11,658,123
Issue date
May 23, 2023
Advanced Micro Devices, Inc.
Rahul Agarwal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for controlling a left ventricular assist device
Patent number
11,517,740
Issue date
Dec 6, 2022
TC1 LLC
Rahul Agarwal
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Circuit board with compact passive component arrangement
Patent number
11,495,588
Issue date
Nov 8, 2022
Advanced Micro Devices, Inc.
Milind Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multirow semiconductor chip connections
Patent number
11,469,183
Issue date
Oct 11, 2022
Advanced Micro Devices, Inc.
Rahul Agarwal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Offset-aligned three-dimensional integrated circuit
Patent number
11,437,359
Issue date
Sep 6, 2022
Advanced Micro Devices, Inc.
Brett P. Wilkerson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip gettering
Patent number
11,393,697
Issue date
Jul 19, 2022
Advanced Micro Devices, Inc.
Rahul Agarwal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded chip package with anchor structures
Patent number
11,367,628
Issue date
Jun 21, 2022
Advanced Micro Devices, Inc.
Priyal Shah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded die last chip combination
Patent number
11,211,332
Issue date
Dec 28, 2021
Advanced Micro Devices, Inc.
Milind S. Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for transcutaneous power transfer using microne...
Patent number
11,197,990
Issue date
Dec 14, 2021
TC1 LLC
Rahul Agarwal
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Coordinated ventricular assist and cardiac rhythm management device...
Patent number
11,167,123
Issue date
Nov 9, 2021
TC1 LLC
Rahul Agarwal
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Multi-chip package with offset 3D structure
Patent number
11,018,125
Issue date
May 25, 2021
Advanced Micro Devices, Inc.
Milind S. Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple-die integrated circuit with integrated voltage regulator
Patent number
11,011,495
Issue date
May 18, 2021
Advanced Micro Devices, Inc.
Milind Bhagavat
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Integrated circuit package with integrated voltage regulator
Patent number
11,011,466
Issue date
May 18, 2021
Advanced Micro Devices, Inc.
Milind S. Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die stacking for multi-tier 3D integration
Patent number
10,930,621
Issue date
Feb 23, 2021
Advanced Micro Devices, Inc.
Rahul Agarwal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density cross link die with polymer routing layer
Patent number
10,923,430
Issue date
Feb 16, 2021
Advanced Micro Devices, Inc.
Chun-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit module with integrated discrete devices
Patent number
10,867,978
Issue date
Dec 15, 2020
Advanced Micro Devices, Inc.
Milind S. Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip gettering
Patent number
10,825,692
Issue date
Nov 3, 2020
Advanced Micro Devices, Inc.
Rahul Agarwal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die stacking for multi-tier 3D integration
Patent number
10,727,204
Issue date
Jul 28, 2020
Advances Micro Devices, Inc.
Rahul Agarwal
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Assessment and Management of Adverse Event Risks in Mechanical Circ...
Publication number
20240139498
Publication date
May 2, 2024
TC1 LLC
Rahul Agarwal
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Application
SEMICONDUCTOR INTERCONNECT BRIDGE PACKAGING
Publication number
20240071937
Publication date
Feb 29, 2024
Microsoft Technology Licensing, LLC
Rahul AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CREATING INTERCONNECTS BETWEEN DIES USING A CROSS-OVER DIE AND THRO...
Publication number
20240071940
Publication date
Feb 29, 2024
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR INTERCONNECT BRIDGE PACKAGING
Publication number
20240071778
Publication date
Feb 29, 2024
Microsoft Technology Licensing, LLC
Rahul AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PARTITIONING WAFER PROCESSING AND HYBRID BONDING OF LAYERS FORMED O...
Publication number
20240071985
Publication date
Feb 29, 2024
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTING SEMICONDCUTOR DEVICE ASSEMBLY COMPONENTS USING INTERCONN...
Publication number
20240071903
Publication date
Feb 29, 2024
ADVANCED MICRO DEVICES, INC.
GABRIEL H. LOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS
Publication number
20240063206
Publication date
Feb 22, 2024
ADVANCED MICRO DEVICES, INC.
John J. Wuu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOUBLE SIDE TRANSISTORS ON SAME SILICON WAFER
Publication number
20240038596
Publication date
Feb 1, 2024
ADVANCED MICRO DEVICES, INC.
Chandra Sekhar Mandalapu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT
Publication number
20240019649
Publication date
Jan 18, 2024
ADVANCED MICRO DEVICES, INC.
BRETT P. WILKERSON
G02 - OPTICS
Information
Patent Application
HIGH-SPEED DIE CONNECTIONS USING A CONDUCTIVE INSERT
Publication number
20230411331
Publication date
Dec 21, 2023
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BONDED INTERCONNECT BRIDGING
Publication number
20230387076
Publication date
Nov 30, 2023
ADVANCED MICRO DEVICES, INC.
LEI FU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKING SEMICONDUCTOR DEVICES BY BONDING FRONT SURFACES OF DIFFERE...
Publication number
20230268319
Publication date
Aug 24, 2023
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH AN EMBEDDED ACTIVE DEVICE
Publication number
20230207544
Publication date
Jun 29, 2023
ADVANCED MICRO DEVICES, INC.
Gabriel H. Loh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW TEMPERATURE HYBRID BONDING
Publication number
20230201952
Publication date
Jun 29, 2023
ADVANCED MICRO DEVICES, INC.
PRIYAL SHAH
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR CHIP DEVICE INTEGRATING THERMAL PIPES IN THREE-DIMENS...
Publication number
20230197563
Publication date
Jun 22, 2023
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR
Publication number
20230197619
Publication date
Jun 22, 2023
ADVANCED MICRO DEVICES, INC.
Gabriel H LOH
G05 - CONTROLLING REGULATING
Information
Patent Application
ELECTRONIC DEVICE INCLUDING AN INTEGRATED CIRCUIT DIE AND A SUPPORT...
Publication number
20230197623
Publication date
Jun 22, 2023
ADVANCED MICRO DEVICES, INC.
Arsalan Alam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP DEVICE
Publication number
20230187364
Publication date
Jun 15, 2023
ADVANCED MICRO DEVICES, INC.
Chia-Hao Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE HAVING A STACKED PASSIVE DE...
Publication number
20230130354
Publication date
Apr 27, 2023
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TESTING A SEMICONDUCTOR DIE USING TEMPORARY TEST PADS APPLIED TO CO...
Publication number
20230120305
Publication date
Apr 20, 2023
ADVANCED MICRO DEVICES, INC.
CHIA-HAO CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods and Systems For Controlling a Left Ventricular Assist Device
Publication number
20230096753
Publication date
Mar 30, 2023
TC1 LLC
Rahul Agarwal
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Application
GLASS CORE PACKAGE SUBSTRATES
Publication number
20230102183
Publication date
Mar 30, 2023
ADVANCED MICRO DEVICES, INC.
Deepak Vasant Kulkarni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DIE COMMUNICATIONS COUPLINGS USING A SINGLE BRIDGE DIE
Publication number
20230069294
Publication date
Mar 2, 2023
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD WITH COMPACT PASSIVE COMPONENT ARRANGEMENT
Publication number
20230047285
Publication date
Feb 16, 2023
ADVANCED MICRO DEVICES, INC.
MILIND S. BHAGAVAT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTROLLED ELECTROSTATIC DISCHARGING TO AVOID LOADING ON INPUT/OUTP...
Publication number
20220415876
Publication date
Dec 29, 2022
ADVANCED MICRO DEVICES, INC.
ROBERT S. RUTH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-LEVEL TESTING OF FANOUT CHIPLETS
Publication number
20220415723
Publication date
Dec 29, 2022
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OFFSET-ALIGNED THREE-DIMENSIONAL INTEGRATED CIRCUIT
Publication number
20220392882
Publication date
Dec 8, 2022
ADVANCED MICRO DEVICES, INC.
Brett P. Wilkerson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT
Publication number
20220342165
Publication date
Oct 27, 2022
ADVANCED MICRO DEVICES, INC.
BRETT P. WILKERSON
G02 - OPTICS
Information
Patent Application
MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES
Publication number
20220319871
Publication date
Oct 6, 2022
ADVANCED MICRO DEVICES, INC.
PRIYAL SHAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL DIE-LAST WAFER-LEVEL FANOUT PACKAGE WITH FIBER ATTACH CAPAB...
Publication number
20220206221
Publication date
Jun 30, 2022
ADVANCED MICRO DEVICES, INC.
SIDDHARTH RAVICHANDRAN
G02 - OPTICS