Rahul Agarwal

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacking power delivery device dies
- Patent number 12,334,488
- Issue date Jun 17, 2025
- Advanced Micro Devices, Inc.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fanout module integrating a photonic integrated circuit
- Patent number 12,276,850
- Issue date Apr 15, 2025
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- G02 - OPTICS
Information Patent Grant
Mixed density interconnect architectures using hybrid fan-out
- Patent number 12,266,611
- Issue date Apr 1, 2025
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded chip package with anchor structures
- Patent number 12,249,519
- Issue date Mar 11, 2025
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed die connections using a conductive insert
- Patent number 12,237,286
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packages with warpage resistance
- Patent number 12,183,675
- Issue date Dec 31, 2024
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating active-bridge-coupled GPU chiplets
- Patent number 12,170,263
- Issue date Dec 17, 2024
- Advanced Micro Devices, Inc.
- Skyler J. Saleh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D semiconductor package with die-mounted voltage regulator
- Patent number 12,165,981
- Issue date Dec 10, 2024
- Advanced Micro Devices, Inc.
- Gabriel H Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonded interconnect bridging
- Patent number 12,107,075
- Issue date Oct 1, 2024
- Advanced Micro Devices, Inc.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass core package substrates
- Patent number 12,080,632
- Issue date Sep 3, 2024
- Advanced Micro Devices, Inc.
- Deepak Vasant Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature hybrid bonding
- Patent number 11,911,839
- Issue date Feb 27, 2024
- Advanced Micro Devices, Inc.
- Priyal Shah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Offset-aligned three-dimensional integrated circuit
- Patent number 11,855,061
- Issue date Dec 26, 2023
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GPU chiplets using high bandwidth crosslinks
- Patent number 11,841,803
- Issue date Dec 12, 2023
- Advanced Micro Devices, Inc.
- Skyler J. Saleh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board with compact passive component arrangement
- Patent number 11,837,588
- Issue date Dec 5, 2023
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Creating interconnects between dies using a cross-over die and thro...
- Patent number 11,830,817
- Issue date Nov 28, 2023
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scheme for enabling die reuse in 3D stacked products
- Patent number 11,804,479
- Issue date Oct 31, 2023
- Advanced Micro Devices, Inc.
- John J. Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed die connections using a conductive insert
- Patent number 11,749,629
- Issue date Sep 5, 2023
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package with reinforcing rivets
- Patent number 11,742,301
- Issue date Aug 29, 2023
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with integrated voltage regulator
- Patent number 11,715,691
- Issue date Aug 1, 2023
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fanout module integrating a photonic integrated circuit
- Patent number 11,709,327
- Issue date Jul 25, 2023
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- G02 - OPTICS
Information Patent Grant
Hybrid bonded interconnect bridging
- Patent number 11,676,940
- Issue date Jun 13, 2023
- Advanced Micro Devices, Inc.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit module with integrated discrete devices
- Patent number 11,670,624
- Issue date Jun 6, 2023
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bridged fanout chiplet connectivity
- Patent number 11,658,123
- Issue date May 23, 2023
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controlling a left ventricular assist device
- Patent number 11,517,740
- Issue date Dec 6, 2022
- TC1 LLC
- Rahul Agarwal
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Circuit board with compact passive component arrangement
- Patent number 11,495,588
- Issue date Nov 8, 2022
- Advanced Micro Devices, Inc.
- Milind Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multirow semiconductor chip connections
- Patent number 11,469,183
- Issue date Oct 11, 2022
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset-aligned three-dimensional integrated circuit
- Patent number 11,437,359
- Issue date Sep 6, 2022
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip gettering
- Patent number 11,393,697
- Issue date Jul 19, 2022
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded chip package with anchor structures
- Patent number 11,367,628
- Issue date Jun 21, 2022
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded die last chip combination
- Patent number 11,211,332
- Issue date Dec 28, 2021
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATING PACKAGES WITH DUMMY DIES HAVING A CONSTRUCTION THAT MIM...
- Publication number 20250201645
- Publication date Jun 19, 2025
- Microsoft Technology Licensing, LLC
- Rahul AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR BRIDGE-BASED PACKAGING WITH DIRECT POWE...
- Publication number 20250201722
- Publication date Jun 19, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel H. Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENABLING MICRO-BUMP ARCHITECTURES WITHOUT THE USE OF SACRIFICIAL PA...
- Publication number 20250070067
- Publication date Feb 27, 2025
- Microsoft Technology Licensing, LLC
- Rahul AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR
- Publication number 20250070031
- Publication date Feb 27, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel H LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PACKAGE SUBSTRATES
- Publication number 20250029900
- Publication date Jan 23, 2025
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED INTERCONNECT BRIDGING
- Publication number 20250022847
- Publication date Jan 16, 2025
- ADVANCED MICRO DEVICES, INC.
- LEI FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING AN ELECTRONIC COMPONENT IN A CORE OF AN INTEGRATED CIRCUI...
- Publication number 20240413029
- Publication date Dec 12, 2024
- Microsoft Technology Licensing, LLC
- Jon Thomas Woodyard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH STACKED INTERPOSER
- Publication number 20240395787
- Publication date Nov 28, 2024
- Microsoft Technology Licensing, LLC
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...
- Publication number 20240387459
- Publication date Nov 21, 2024
- Microsoft Technology Licensing, LLC
- Haohua ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GPU CHIPLETS USING HIGH BANDWIDTH CROSSLINKS
- Publication number 20240330196
- Publication date Oct 3, 2024
- ADVANCED MICRO DEVICES, INC.
- Skyler J. SALEH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Assessment and Management of Adverse Event Risks in Mechanical Circ...
- Publication number 20240139498
- Publication date May 2, 2024
- TC1 LLC
- Rahul Agarwal
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR INTERCONNECT BRIDGE PACKAGING
- Publication number 20240071937
- Publication date Feb 29, 2024
- Microsoft Technology Licensing, LLC
- Rahul AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CREATING INTERCONNECTS BETWEEN DIES USING A CROSS-OVER DIE AND THRO...
- Publication number 20240071940
- Publication date Feb 29, 2024
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT BRIDGE PACKAGING
- Publication number 20240071778
- Publication date Feb 29, 2024
- Microsoft Technology Licensing, LLC
- Rahul AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTITIONING WAFER PROCESSING AND HYBRID BONDING OF LAYERS FORMED O...
- Publication number 20240071985
- Publication date Feb 29, 2024
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING SEMICONDCUTOR DEVICE ASSEMBLY COMPONENTS USING INTERCONN...
- Publication number 20240071903
- Publication date Feb 29, 2024
- ADVANCED MICRO DEVICES, INC.
- GABRIEL H. LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS
- Publication number 20240063206
- Publication date Feb 22, 2024
- ADVANCED MICRO DEVICES, INC.
- John J. Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SIDE TRANSISTORS ON SAME SILICON WAFER
- Publication number 20240038596
- Publication date Feb 1, 2024
- ADVANCED MICRO DEVICES, INC.
- Chandra Sekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT
- Publication number 20240019649
- Publication date Jan 18, 2024
- ADVANCED MICRO DEVICES, INC.
- BRETT P. WILKERSON
- G02 - OPTICS
Information Patent Application
HIGH-SPEED DIE CONNECTIONS USING A CONDUCTIVE INSERT
- Publication number 20230411331
- Publication date Dec 21, 2023
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED INTERCONNECT BRIDGING
- Publication number 20230387076
- Publication date Nov 30, 2023
- ADVANCED MICRO DEVICES, INC.
- LEI FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING SEMICONDUCTOR DEVICES BY BONDING FRONT SURFACES OF DIFFERE...
- Publication number 20230268319
- Publication date Aug 24, 2023
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AN EMBEDDED ACTIVE DEVICE
- Publication number 20230207544
- Publication date Jun 29, 2023
- ADVANCED MICRO DEVICES, INC.
- Gabriel H. Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING POWER DELIVERY DEVICE DIES
- Publication number 20230207546
- Publication date Jun 29, 2023
- ADVANCED MICRO DEVICES, INC.
- ARSALAN ALAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE HYBRID BONDING
- Publication number 20230201952
- Publication date Jun 29, 2023
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP DEVICE INTEGRATING THERMAL PIPES IN THREE-DIMENS...
- Publication number 20230197563
- Publication date Jun 22, 2023
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR
- Publication number 20230197619
- Publication date Jun 22, 2023
- ADVANCED MICRO DEVICES, INC.
- Gabriel H LOH
- G05 - CONTROLLING REGULATING
Information Patent Application
ELECTRONIC DEVICE INCLUDING AN INTEGRATED CIRCUIT DIE AND A SUPPORT...
- Publication number 20230197623
- Publication date Jun 22, 2023
- ADVANCED MICRO DEVICES, INC.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE
- Publication number 20230187364
- Publication date Jun 15, 2023
- ADVANCED MICRO DEVICES, INC.
- Chia-Hao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE HAVING A STACKED PASSIVE DE...
- Publication number 20230130354
- Publication date Apr 27, 2023
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS

Rahul Agarwal

Person

Patents Grantslast 30 patents

Stacking power delivery device dies

Fanout module integrating a photonic integrated circuit

Mixed density interconnect architectures using hybrid fan-out

Molded chip package with anchor structures

High-speed die connections using a conductive insert

Fan-out packages with warpage resistance

Fabricating active-bridge-coupled GPU chiplets

3D semiconductor package with die-mounted voltage regulator

Hybrid bonded interconnect bridging

Glass core package substrates

Low temperature hybrid bonding

Offset-aligned three-dimensional integrated circuit

GPU chiplets using high bandwidth crosslinks

Circuit board with compact passive component arrangement

Creating interconnects between dies using a cross-over die and thro...

Scheme for enabling die reuse in 3D stacked products

High-speed die connections using a conductive insert

Fan-out package with reinforcing rivets

Integrated circuit package with integrated voltage regulator

Fanout module integrating a photonic integrated circuit

Hybrid bonded interconnect bridging

Integrated circuit module with integrated discrete devices

Hybrid bridged fanout chiplet connectivity

Methods for controlling a left ventricular assist device

Circuit board with compact passive component arrangement

Multirow semiconductor chip connections

Offset-aligned three-dimensional integrated circuit

Semiconductor chip gettering

Molded chip package with anchor structures

Molded die last chip combination

Patents Applicationslast 30 patents

FABRICATING PACKAGES WITH DUMMY DIES HAVING A CONSTRUCTION THAT MIM...

APPARATUSES AND METHODS FOR BRIDGE-BASED PACKAGING WITH DIRECT POWE...

ENABLING MICRO-BUMP ARCHITECTURES WITHOUT THE USE OF SACRIFICIAL PA...

3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR

GLASS CORE PACKAGE SUBSTRATES

HYBRID BONDED INTERCONNECT BRIDGING

EMBEDDING AN ELECTRONIC COMPONENT IN A CORE OF AN INTEGRATED CIRCUI...

INTEGRATED CIRCUIT WITH STACKED INTERPOSER

THREE-DIMENSIONAL INTEGRATED CIRCUIT (3DIC) SYSTEMS WITH A HEAT SPR...

GPU CHIPLETS USING HIGH BANDWIDTH CROSSLINKS

Assessment and Management of Adverse Event Risks in Mechanical Circ...

SEMICONDUCTOR INTERCONNECT BRIDGE PACKAGING

CREATING INTERCONNECTS BETWEEN DIES USING A CROSS-OVER DIE AND THRO...

SEMICONDUCTOR INTERCONNECT BRIDGE PACKAGING

PARTITIONING WAFER PROCESSING AND HYBRID BONDING OF LAYERS FORMED O...

CONNECTING SEMICONDCUTOR DEVICE ASSEMBLY COMPONENTS USING INTERCONN...

SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS

DOUBLE SIDE TRANSISTORS ON SAME SILICON WAFER

FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT

HIGH-SPEED DIE CONNECTIONS USING A CONDUCTIVE INSERT

HYBRID BONDED INTERCONNECT BRIDGING

STACKING SEMICONDUCTOR DEVICES BY BONDING FRONT SURFACES OF DIFFERE...

SEMICONDUCTOR DEVICE WITH AN EMBEDDED ACTIVE DEVICE

STACKING POWER DELIVERY DEVICE DIES

LOW TEMPERATURE HYBRID BONDING

SEMICONDUCTOR CHIP DEVICE INTEGRATING THERMAL PIPES IN THREE-DIMENS...

3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR

ELECTRONIC DEVICE INCLUDING AN INTEGRATED CIRCUIT DIE AND A SUPPORT...

SEMICONDUCTOR CHIP DEVICE

THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE HAVING A STACKED PASSIVE DE...