Rahul Gupta

Person

Newark, DE, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fluorocarbon molecules for high aspect ratio oxide etch
- Patent number 11,152,223
- Issue date Oct 19, 2021
- American Air Liquide, Inc.
- Curtis Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemistries for TSV/MEMS/power device etching
- Patent number 10,720,335
- Issue date Jul 21, 2020
- American Air Liquide, Inc.
- Peng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iodine-containing compounds for etching semiconductor structures
- Patent number 10,607,850
- Issue date Mar 31, 2020
- American Air Liquide, Inc.
- Vijay Surla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrofluorocarbons containing —NH2 functional group for 3D NAND and...
- Patent number 10,410,878
- Issue date Sep 10, 2019
- American Air Liquide, Inc.
- Hui Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluorocarbon molecules for high aspect ratio oxide etch
- Patent number 10,381,240
- Issue date Aug 13, 2019
- American Air Liquide, Inc.
- Curtis Anderson
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Nitrogen-containing compounds for etching semiconductor structures
- Patent number 10,256,109
- Issue date Apr 9, 2019
- American Air Liquide, Inc.
- Vijay Surla
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Gases for low damage selective silicon nitride etching
- Patent number 10,217,681
- Issue date Feb 26, 2019
- American Air Liquide, Inc.
- James Royer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching semiconductor structures with etch gas
- Patent number 10,115,600
- Issue date Oct 30, 2018
- L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GE...
- Rahul Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chemistries for TSV/MEMS/power device etching
- Patent number 10,103,031
- Issue date Oct 16, 2018
- L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Georges Claude
- Peng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemistries for TSV/MEMS/power device etching
- Patent number 9,892,932
- Issue date Feb 13, 2018
- L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GE...
- Peng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching semiconductor structures with etch gas
- Patent number 9,773,679
- Issue date Sep 26, 2017
- American Air Liquide, Inc.
- Rahul Gupta
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Atomic layer or cyclic plasma etching chemistries and processes
- Patent number 9,773,683
- Issue date Sep 26, 2017
- American Air Liquide, Inc.
- Rahul Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Nitrogen-containing compounds for etching semiconductor structures
- Patent number 9,659,788
- Issue date May 23, 2017
- American Air Liquide, Inc.
- Vijay Surla
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Fluorocarbon molecules for high aspect ratio oxide etch
- Patent number 9,514,959
- Issue date Dec 6, 2016
- American Air Liquide, Inc.
- Curtis Anderson
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Method of fabricating monolithic nanoscale probes
- Patent number 7,868,426
- Issue date Jan 11, 2011
- University of Delaware
- Brian G. Willis
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
FLUOROCARBON MOLECULES FOR HIGH ASPECT RATIO OXIDE ETCH
- Publication number 20190326129
- Publication date Oct 24, 2019
- American Air Liquide, Inc.
- Curtis ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYDROFLUOROCARBONS CONTAINING –NH2 FUNCTIONAL GROUP FOR 3D NAND AND...
- Publication number 20190131140
- Publication date May 2, 2019
- American Air Liquide, Inc.
- Hui SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMISTRIES FOR TSV/MEMS/POWER DEVICE ETCHING
- Publication number 20180366336
- Publication date Dec 20, 2018
- American Air Liquide, Inc.
- Peng SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GASES FOR LOW DAMAGE SELECTIVE SILICON NITRIDE ETCHING
- Publication number 20180277387
- Publication date Sep 27, 2018
- American Air Liquide, Inc.
- James ROYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMISTRIES FOR TSV/MEMS/POWER DEVICE ETCHING
- Publication number 20180076046
- Publication date Mar 15, 2018
- American Air Liquide, Inc.
- Peng SHEN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF ETCHING SEMICONDUCTOR STRUCTURES WITH ETCH GAS
- Publication number 20170352546
- Publication date Dec 7, 2017
- American Air Liquide, Inc.
- Rahul GUPTA
- C07 - ORGANIC CHEMISTRY
Information Patent Application
NITROGEN-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES
- Publication number 20170229316
- Publication date Aug 10, 2017
- American Air Liquide, Inc.
- Vijay SURLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IODINE-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES
- Publication number 20170178923
- Publication date Jun 22, 2017
- American Air Liquide, Inc.
- Vijay SURLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMISTRIES FOR TSV/MEMS/POWER DEVICE ETCHING
- Publication number 20170103901
- Publication date Apr 13, 2017
- American Air Liquide, Inc.
- Peng SHEN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLUOROCARBON MOLECULES FOR HIGH ASPECT RATIO OXIDE ETCH
- Publication number 20170032976
- Publication date Feb 2, 2017
- American Air Liquide, Inc.
- Curtis ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ETCHING SEMICONDUCTOR STRUCTURES WITH ETCH GAS
- Publication number 20160307764
- Publication date Oct 20, 2016
- American Air Liquide, Inc.
- Rahul GUPTA
- C07 - ORGANIC CHEMISTRY
Information Patent Application
NITROGEN-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES
- Publication number 20150371869
- Publication date Dec 24, 2015
- American Air Liquide, Inc.
- Vijay SURLA
- C07 - ORGANIC CHEMISTRY
Information Patent Application
FLUOROCARBON MOLECULES FOR HIGH ASPECT RATIO OXIDE ETCH
- Publication number 20150294880
- Publication date Oct 15, 2015
- L'air Liquide, Societe Anonyme Pour L'Etude et L'Exploitation Des Procedes Ge...
- Curtis ANDERSON
- C07 - ORGANIC CHEMISTRY
Information Patent Application
ATOMIC LAYER OR CYCLIC PLASMA ETCHING CHEMISTRIES AND PROCESSES
- Publication number 20150270140
- Publication date Sep 24, 2015
- American Air Liquide, Inc.
- Rahul GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ASHING COMPOUNDS AND METHODS OF USE
- Publication number 20120227762
- Publication date Sep 13, 2012
- American Air Liquide, Inc.
- Christian Dussarrat
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF FABRICATING MONOLITHIC NANOSCALE PROBES
- Publication number 20090085556
- Publication date Apr 2, 2009
- University of Delaware
- Brian G. Willis
- B82 - NANO-TECHNOLOGY

Rahul Gupta

Person

Patents Grantslast 30 patents

Fluorocarbon molecules for high aspect ratio oxide etch

Chemistries for TSV/MEMS/power device etching

Iodine-containing compounds for etching semiconductor structures

Hydrofluorocarbons containing —NH2 functional group for 3D NAND and...

Fluorocarbon molecules for high aspect ratio oxide etch

Nitrogen-containing compounds for etching semiconductor structures

Gases for low damage selective silicon nitride etching

Method of etching semiconductor structures with etch gas

Chemistries for TSV/MEMS/power device etching

Chemistries for TSV/MEMS/power device etching

Method of etching semiconductor structures with etch gas

Atomic layer or cyclic plasma etching chemistries and processes

Nitrogen-containing compounds for etching semiconductor structures

Fluorocarbon molecules for high aspect ratio oxide etch

Method of fabricating monolithic nanoscale probes

Patents Applicationslast 30 patents

FLUOROCARBON MOLECULES FOR HIGH ASPECT RATIO OXIDE ETCH

HYDROFLUOROCARBONS CONTAINING –NH2 FUNCTIONAL GROUP FOR 3D NAND AND...

CHEMISTRIES FOR TSV/MEMS/POWER DEVICE ETCHING

GASES FOR LOW DAMAGE SELECTIVE SILICON NITRIDE ETCHING

CHEMISTRIES FOR TSV/MEMS/POWER DEVICE ETCHING

METHOD OF ETCHING SEMICONDUCTOR STRUCTURES WITH ETCH GAS

NITROGEN-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES

IODINE-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES

CHEMISTRIES FOR TSV/MEMS/POWER DEVICE ETCHING

FLUOROCARBON MOLECULES FOR HIGH ASPECT RATIO OXIDE ETCH

METHOD OF ETCHING SEMICONDUCTOR STRUCTURES WITH ETCH GAS

NITROGEN-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES

FLUOROCARBON MOLECULES FOR HIGH ASPECT RATIO OXIDE ETCH

ATOMIC LAYER OR CYCLIC PLASMA ETCHING CHEMISTRIES AND PROCESSES

PLASMA ASHING COMPOUNDS AND METHODS OF USE

METHOD OF FABRICATING MONOLITHIC NANOSCALE PROBES