Rahul Jain

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods to selectively embed magnetic materials in substrate and co...
- Patent number 12,154,715
- Issue date Nov 26, 2024
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protruding SN substrate features for epoxy flow control
- Patent number 12,009,271
- Issue date Jun 11, 2024
- Intel Corporation
- Edvin Cetegen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 11,935,805
- Issue date Mar 19, 2024
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly with encapsulated magnetic feature
- Patent number 11,901,115
- Issue date Feb 13, 2024
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
- Patent number 11,881,463
- Issue date Jan 23, 2024
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,862,552
- Issue date Jan 2, 2024
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrates, a semiconductor device and a method fo...
- Patent number 11,842,981
- Issue date Dec 12, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corner guard for improved electroplated first level interconnect bu...
- Patent number 11,776,864
- Issue date Oct 3, 2023
- Intel Corporation
- Jacob Vehonsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to embed magnetic material as first layer on coreless subst...
- Patent number 11,735,537
- Issue date Aug 22, 2023
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,737,208
- Issue date Aug 22, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 11,664,290
- Issue date May 30, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package including a capacitor
- Patent number 11,652,071
- Issue date May 16, 2023
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning of thin film capacitors in organic substrate packages
- Patent number 11,651,902
- Issue date May 16, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Release layer-assisted selective embedding of magnetic material in...
- Patent number 11,610,706
- Issue date Mar 21, 2023
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to pattern TFC and incorporation in the ODI architecture an...
- Patent number 11,581,271
- Issue date Feb 14, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity structures in integrated circuit package supports
- Patent number 11,557,489
- Issue date Jan 17, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to selectively embed magnetic materials in substrate and co...
- Patent number 11,450,471
- Issue date Sep 20, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film barrier seed metallization in magnetic-plugged through ho...
- Patent number 11,443,885
- Issue date Sep 13, 2022
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly with encapsulated magnetic feature
- Patent number 11,443,892
- Issue date Sep 13, 2022
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for attaching large components in a package substrate for a...
- Patent number 11,432,405
- Issue date Aug 30, 2022
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to embed magnetic material as first layer on coreless subst...
- Patent number 11,417,614
- Issue date Aug 16, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to incorporate thin film capacitor sheets (TFC-S) in the bu...
- Patent number 11,410,921
- Issue date Aug 9, 2022
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding magnetic material, in a cored or coreless semiconductor p...
- Patent number 11,355,459
- Issue date Jun 7, 2022
- INTEL CORPOATION
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor structures for package devices
- Patent number 11,335,632
- Issue date May 17, 2022
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,251,113
- Issue date Feb 15, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a coaxial first layer interconnect
- Patent number 11,244,912
- Issue date Feb 8, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
- Patent number 11,205,626
- Issue date Dec 21, 2021
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 11,158,558
- Issue date Oct 26, 2021
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrates, a semiconductor device and a method fo...
- Patent number 11,139,264
- Issue date Oct 5, 2021
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-embedded thin-film capacitors, package-integral magnetic in...
- Patent number 10,971,492
- Issue date Apr 6, 2021
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
- Publication number 20240258183
- Publication date Aug 1, 2024
- Intel Corporation
- Edvin CETEGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
- Publication number 20240186202
- Publication date Jun 6, 2024
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...
- Publication number 20240063173
- Publication date Feb 22, 2024
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...
- Publication number 20230345621
- Publication date Oct 26, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...
- Publication number 20230343723
- Publication date Oct 26, 2023
- Intel Corporation
- Nicholas NEAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
- Publication number 20230245940
- Publication date Aug 3, 2023
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO SELECTIVELY EMBED MAGNETIC MATERIALS IN SUBSTRATE AND CO...
- Publication number 20220367104
- Publication date Nov 17, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE
- Publication number 20220359115
- Publication date Nov 10, 2022
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO EMBED MAGNETIC MATERIAL AS FIRST LAYER ON CORELESS SUBST...
- Publication number 20220328431
- Publication date Oct 13, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES
- Publication number 20220230951
- Publication date Jul 21, 2022
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES
- Publication number 20220130748
- Publication date Apr 28, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...
- Publication number 20220068847
- Publication date Mar 3, 2022
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...
- Publication number 20210398941
- Publication date Dec 23, 2021
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
- Publication number 20210391232
- Publication date Dec 16, 2021
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE INCLUDING A CAPACITOR
- Publication number 20210151393
- Publication date May 20, 2021
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
- Publication number 20210111088
- Publication date Apr 15, 2021
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ATTACHMENT AND/OR STOP STRUCTURES
- Publication number 20210066162
- Publication date Mar 4, 2021
- Intel Corporation
- Sergio A. CHAN ARGUEDAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...
- Publication number 20210035921
- Publication date Feb 4, 2021
- Intel Corporation
- Nicholas NEAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
- Publication number 20210020531
- Publication date Jan 21, 2021
- Intel Corporation
- Edvin CETEGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BU...
- Publication number 20210020532
- Publication date Jan 21, 2021
- Intel Corporation
- Jacob VEHONSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHICALLY DEFINED VERTICAL INTERCONNECT ACCESS (VIA) FOR A B...
- Publication number 20200411441
- Publication date Dec 31, 2020
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE INCLUDING A CAPACITOR
- Publication number 20200312793
- Publication date Oct 1, 2020
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO PATTERN TFC AND INCORPORATION IN THE ODI ARCHITECTURE AN...
- Publication number 20200294938
- Publication date Sep 17, 2020
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...
- Publication number 20200279819
- Publication date Sep 3, 2020
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-EMBEDDED THIN-FILM CAPACITORS, PACKAGE-INTEGRAL MAGNETIC IN...
- Publication number 20200251467
- Publication date Aug 6, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...
- Publication number 20200253037
- Publication date Aug 6, 2020
- Intel Corporation
- Brandon C. Marin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE EMBEDDED HEAT PIPE
- Publication number 20200176355
- Publication date Jun 4, 2020
- Intel Corporation
- Robert A. May
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A COAXIAL FIRST LAYER INTERCONNECT
- Publication number 20200168569
- Publication date May 28, 2020
- Intel Corporation
- Sai VADLAMANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...
- Publication number 20200075511
- Publication date Mar 5, 2020
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY STRUCTURES IN INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20200066543
- Publication date Feb 27, 2020
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Methods to selectively embed magnetic materials in substrate and co...

Protruding SN substrate features for epoxy flow control

Package with underfill containment barrier

Substrate assembly with encapsulated magnetic feature

Coreless organic packages with embedded die and magnetic inductor s...

Methods of embedding magnetic structures in substrates

Die interconnect substrates, a semiconductor device and a method fo...

Corner guard for improved electroplated first level interconnect bu...

Methods to embed magnetic material as first layer on coreless subst...

Microelectronic assemblies having conductive structures with differ...

Package with underfill containment barrier

Electronic device package including a capacitor

Patterning of thin film capacitors in organic substrate packages

Release layer-assisted selective embedding of magnetic material in...

Methods to pattern TFC and incorporation in the ODI architecture an...

Cavity structures in integrated circuit package supports

Methods to selectively embed magnetic materials in substrate and co...

Thin film barrier seed metallization in magnetic-plugged through ho...

Substrate assembly with encapsulated magnetic feature

Methods for attaching large components in a package substrate for a...

Methods to embed magnetic material as first layer on coreless subst...

Methods to incorporate thin film capacitor sheets (TFC-S) in the bu...

Embedding magnetic material, in a cored or coreless semiconductor p...

Magnetic inductor structures for package devices

Methods of embedding magnetic structures in substrates

Semiconductor package having a coaxial first layer interconnect

Coreless organic packages with embedded die and magnetic inductor s...

Package with underfill containment barrier

Die interconnect substrates, a semiconductor device and a method fo...

Package-embedded thin-film capacitors, package-integral magnetic in...

Patents Applicationslast 30 patents

PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...

SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

METHODS TO SELECTIVELY EMBED MAGNETIC MATERIALS IN SUBSTRATE AND CO...

SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE

METHODS TO EMBED MAGNETIC MATERIAL AS FIRST LAYER ON CORELESS SUBST...

MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES

METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES

CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...

DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

ELECTRONIC DEVICE PACKAGE INCLUDING A CAPACITOR

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

SEMICONDUCTOR PACKAGE WITH ATTACHMENT AND/OR STOP STRUCTURES

SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...

PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL

CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BU...

LITHOGRAPHICALLY DEFINED VERTICAL INTERCONNECT ACCESS (VIA) FOR A B...

ELECTRONIC DEVICE PACKAGE INCLUDING A CAPACITOR

METHODS TO PATTERN TFC AND INCORPORATION IN THE ODI ARCHITECTURE AN...

CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...

PACKAGE-EMBEDDED THIN-FILM CAPACITORS, PACKAGE-INTEGRAL MAGNETIC IN...

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...

SUBSTRATE EMBEDDED HEAT PIPE

SEMICONDUCTOR PACKAGE HAVING A COAXIAL FIRST LAYER INTERCONNECT

CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...

CAVITY STRUCTURES IN INTEGRATED CIRCUIT PACKAGE SUPPORTS