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Rahul Kapoor
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Singapore, SG
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last 30 patents
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Patent Grant
Molded high density electronic packaging structure for high perform...
Patent number
7,361,995
Issue date
Apr 22, 2008
Xilinx, Inc.
Kim Yong Goh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Molded high density electronic packaging structure for high perform...
Publication number
20060087033
Publication date
Apr 27, 2006
Kim Yong Goh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
3D MEMS/MOEMS package
Publication number
20040140475
Publication date
Jul 22, 2004
United Test & Assembly Center Limited
Yi-Sheng Sun
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Patent Application
Wl-bga for MEMS/MOEMS devices
Publication number
20040140557
Publication date
Jul 22, 2004
United Test & Assembly Center Limited
Yi-Sheng Sun
B81 - MICRO-STRUCTURAL TECHNOLOGY