Raihei IKUMOTO

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Copper electrolytic plating bath and copper electrolytic plating film
- Patent number 11,248,305
- Issue date Feb 15, 2022
- C. Uyemura & Co., Ltd.
- Naoyuki Omura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
COPPER ELECTROLYTIC PLATING BATH AND COPPER ELECTROLYTIC PLATING FILM
- Publication number 20180305833
- Publication date Oct 25, 2018
- C. Uyemura & Co., Ltd.
- Naoyuki OMURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN OR TIN ALLOY ELECTROPLATING BATH AND PROCESS FOR PRODUCING BUMP...
- Publication number 20150267310
- Publication date Sep 24, 2015
- C. Uyemura & Co., Ltd.
- Raihei IKUMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR