Rainer E. Thomas

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Roseville, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Mainboard assembly including a package overlying a die directly att...
- Patent number 10,555,417
- Issue date Feb 4, 2020
- Intel Corporation
- Damion Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mainboard assembly including a package overlying a die directly att...
- Patent number 10,251,273
- Issue date Apr 2, 2019
- Intel Corporation
- Damion Searls
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic packaging including die with through silicon via
- Patent number 7,317,256
- Issue date Jan 8, 2008
- Intel Corporation
- Christina K. Williams
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MAINBOARD ASSEMBLY INCLUDING A PACKAGE OVERLYING A DIE DIRECTLY ATT...
- Publication number 20190182958
- Publication date Jun 13, 2019
- Intel Corporation
- Damion SEARLS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mainboard assembly including a package overlying a die directly att...
- Publication number 20100061056
- Publication date Mar 11, 2010
- Damion Searls
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic packaging including die with through silicon via
- Publication number 20060273455
- Publication date Dec 7, 2006
- Intel Corporation
- Christina K. Williams
- H01 - BASIC ELECTRIC ELEMENTS