Rainer HOLZHAIDER

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with through-substrate via and corresponding m...
- Patent number 10,468,541
- Issue date Nov 5, 2019
- AMS AG
- Franz Schrank
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA AND CORRESPONDING M...
- Publication number 20160322519
- Publication date Nov 3, 2016
- ams AG
- Franz SCHRANK
- H01 - BASIC ELECTRIC ELEMENTS