Rainer Steiner

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Current sensor device
- Patent number 9,658,296
- Issue date May 23, 2017
- Infineon Technologies AG
- Udo Ausserlechner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Chip arrangement and a method of manufacturing a chip arrangement
- Patent number 9,041,226
- Issue date May 26, 2015
- Infineon Technologies AG
- Rainer Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 8,786,085
- Issue date Jul 22, 2014
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 8,759,207
- Issue date Jun 24, 2014
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device stack and method for its production
- Patent number 8,659,135
- Issue date Feb 25, 2014
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device fabricated using an electroplating process
- Patent number 8,334,202
- Issue date Dec 18, 2012
- Infineon Technologies AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including molding compound layer forms a commo...
- Patent number 8,330,273
- Issue date Dec 11, 2012
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 8,330,274
- Issue date Dec 11, 2012
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 8,148,257
- Issue date Apr 3, 2012
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including conductive element
- Patent number 8,072,071
- Issue date Dec 6, 2011
- Infineon Technologies AG
- Rainer Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including covering a semiconductor with a mold...
- Patent number 7,863,088
- Issue date Jan 4, 2011
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with plastic housing, and process for produ...
- Patent number 7,772,105
- Issue date Aug 10, 2010
- Infineon Technologies AG
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate of a semiconductor component comprising rubber-ela...
- Patent number 7,638,418
- Issue date Dec 29, 2009
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component with plastic housing, and process for produ...
- Patent number 7,327,023
- Issue date Feb 5, 2008
- Infineon Technologies AG
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with a housing package
- Patent number 7,319,598
- Issue date Jan 15, 2008
- Infineon Technologies AG
- Rainer Steiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component with electromagnetic shielding device
- Patent number 7,009,288
- Issue date Mar 7, 2006
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Current Sensor Device
- Publication number 20150015249
- Publication date Jan 15, 2015
- INFINEON TECHNOLOGIES AG
- Udo AUSSERLECHNER
- G01 - MEASURING TESTING
Information Patent Application
CHIP ARRANGEMENT AND A METHOD OF MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20140264950
- Publication date Sep 18, 2014
- INFINEON TECHNOLOGIES AG
- Rainer Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20130309864
- Publication date Nov 21, 2013
- Infineon Technologies AG
- Hans-Joachim BARTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20130062770
- Publication date Mar 14, 2013
- Infineon Technologies AG
- Hans-Joachim BARTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20120080791
- Publication date Apr 5, 2012
- Hans-Joachim BARTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20120074574
- Publication date Mar 29, 2012
- Hans-Joachim BARTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20110291274
- Publication date Dec 1, 2011
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Chip Package and Semiconduct...
- Publication number 20110291256
- Publication date Dec 1, 2011
- Rainer Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FABRICATED USING AN ELECTROPLATING PROCESS
- Publication number 20110101532
- Publication date May 5, 2011
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110024915
- Publication date Feb 3, 2011
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE ELEMENT
- Publication number 20100207272
- Publication date Aug 19, 2010
- INFINEON TECHNOLOGIES AG
- Rainer Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCOTOR DEVICE
- Publication number 20090160053
- Publication date Jun 25, 2009
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080284035
- Publication date Nov 20, 2008
- INFINEON TECHNOLOGIES AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component with Plastic Housing, and Process for Produ...
- Publication number 20080050907
- Publication date Feb 28, 2008
- INFINEON TECHNOLOGIES AG
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Stack and Method for Its Production
- Publication number 20070278639
- Publication date Dec 6, 2007
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wiring Substrate of a Semiconductor Component Comprising External C...
- Publication number 20070194459
- Publication date Aug 23, 2007
- Infineon Technologies AG
- Michael Bauer
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic component and electronic configuration
- Publication number 20070018308
- Publication date Jan 25, 2007
- Albert Schott
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component with a housing package
- Publication number 20060126313
- Publication date Jun 15, 2006
- Rainer Steiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor component with plastic housing, and process for produ...
- Publication number 20060076667
- Publication date Apr 13, 2006
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component with electromagnetic shielding device
- Publication number 20050077596
- Publication date Apr 14, 2005
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Rainer Steiner

Person

Patents Grantslast 30 patents

Current sensor device

Chip arrangement and a method of manufacturing a chip arrangement

Semiconductor structure and method for making same

Semiconductor structure and method for making same

Semiconductor device stack and method for its production

Device fabricated using an electroplating process

Semiconductor device including molding compound layer forms a commo...

Semiconductor structure and method for making same

Semiconductor structure and method for making same

Semiconductor device including conductive element

Semiconductor device including covering a semiconductor with a mold...

Semiconductor component with plastic housing, and process for produ...

Wiring substrate of a semiconductor component comprising rubber-ela...

Semiconductor component with plastic housing, and process for produ...

Electronic component with a housing package

Semiconductor component with electromagnetic shielding device

Patents Applicationslast 30 patents

Current Sensor Device

CHIP ARRANGEMENT AND A METHOD OF MANUFACTURING A CHIP ARRANGEMENT

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Method for Fabricating a Semiconductor Chip Package and Semiconduct...

DEVICE FABRICATED USING AN ELECTROPLATING PROCESS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE ELEMENT

METHOD OF MANUFACTURING A SEMICONDUCOTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor Component with Plastic Housing, and Process for Produ...

Semiconductor Device Stack and Method for Its Production

Wiring Substrate of a Semiconductor Component Comprising External C...

Electronic component and electronic configuration

Electronic component with a housing package

Semiconductor component with plastic housing, and process for produ...

Semiconductor component with electromagnetic shielding device