Raiyo F. Aspandiar

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Portland, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for surface mounting a heatsink to a printed circuit board
- Patent number 5,779,134
- Issue date Jul 14, 1998
- Intel Corporation
- Jeff R. Watson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for removing heat from an integrated circuit package that...
- Patent number 5,617,294
- Issue date Apr 1, 1997
- Intel Corporation
- Jeff R. Watson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Built up lands
- Publication number 20040124006
- Publication date Jul 1, 2004
- Tom E. Pearson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...