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Raiyomand Aspandiar
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Porland, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Silicon photonic integrated lens compatible with wafer processing
Patent number
11,894,474
Issue date
Feb 6, 2024
Intel Corporation
Priyanka Dobriyal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Decoupling layer to reduce underfill stress in semiconductor devices
Patent number
11,715,928
Issue date
Aug 1, 2023
Intel Corporation
Priyanka Dobriyal
G02 - OPTICS
Information
Patent Grant
Apparatus and method for conformal coating of integrated circuit pa...
Patent number
10,356,912
Issue date
Jul 16, 2019
Intel Corporation
Priyanka Dobriyal
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and structure for identifying lead-free solder
Patent number
7,251,880
Issue date
Aug 7, 2007
Intel Corporation
Tom E. Pearson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Soldered heat sink anchor and method of use
Patent number
7,183,496
Issue date
Feb 27, 2007
Intel Corporation
George Arrigotti
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heat-shrinkable retainer for PCB double-sided assembly
Patent number
7,131,193
Issue date
Nov 7, 2006
Intel Corporation
Arjang Fartash
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Extension mechanism and method for assembling overhanging components
Patent number
6,917,524
Issue date
Jul 12, 2005
Intel Corporation
Tom E. Pearson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heat-shrinkable retainer for PCB double-sided assembly
Patent number
6,906,268
Issue date
Jun 14, 2005
Intel Corporation
Arjang Fartash
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Retainer for circuit board assembly and method for using the same
Patent number
6,875,931
Issue date
Apr 5, 2005
Intel Corporation
Christopher D. Combs
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Extension mechanism and method for assembling overhanging components
Patent number
6,801,436
Issue date
Oct 5, 2004
Intel Corporation
Tom E. Pearson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interposer to couple a microelectronic device package to a circuit...
Patent number
6,791,035
Issue date
Sep 14, 2004
Intel Corporation
Thomas E. Pearson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Epoxy washer for retention of inverted SMT components
Patent number
6,791,189
Issue date
Sep 14, 2004
Intel Corporation
Tom E. Pearson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Zero insertion force heat-activated retention pin
Patent number
6,764,325
Issue date
Jul 20, 2004
Intel Corporation
George Arrigotti
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Soldered heat sink anchor and method of use
Patent number
6,734,371
Issue date
May 11, 2004
Intel Corporation
George Arrigotti
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Retainer for circuit board assembly and method for using the same
Patent number
6,700,800
Issue date
Mar 2, 2004
Intel Corporation
Christopher Combs
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods for retaining assembled components
Patent number
6,691,407
Issue date
Feb 17, 2004
Intel Corporation
Tom E. Pearson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods and electronic board products utilizing endothermic materia...
Patent number
6,651,869
Issue date
Nov 25, 2003
Intel Corporation
Raiyomand F. Aspandiar
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Surface mount component
Patent number
6,552,275
Issue date
Apr 22, 2003
Intel Corporation
Arjang Fartash
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heatsink mounting with shock absorbers
Patent number
6,501,658
Issue date
Dec 31, 2002
Intel Corporation
Tom E. Pearson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board with embedded thermocouple junctions
Patent number
6,472,612
Issue date
Oct 29, 2002
Intel Corporation
Arjang Fartash
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
SELECTIVE PROTECTION OF INTEGRATED CIRCUIT CHIP SURFACE REGIONS FRO...
Publication number
20230084375
Publication date
Mar 16, 2023
Intel Corporation
Priyanka Dobriyal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTIPLE METAL LAYERS WITHIN A PHOTONICS INTEGRATED CIRCUIT FOR THE...
Publication number
20220416503
Publication date
Dec 29, 2022
Intel Corporation
Priyanka DOBRIYAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILICON PHOTONIC INTEGRATED LENS COMPATIBLE WITH WAFER PROCESSING
Publication number
20210074866
Publication date
Mar 11, 2021
Intel Corporation
Priyanka DOBRIYAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DECOUPLING LAYER TO REDUCE UNDERFILL STRESS IN SEMICONDUCTOR DEVICES
Publication number
20210066882
Publication date
Mar 4, 2021
Intel Corporation
Priyanka Dobriyal
G02 - OPTICS
Information
Patent Application
CONFORMAL COATING OF INTEGRATED CIRCUIT PACKAGES
Publication number
20180070456
Publication date
Mar 8, 2018
Intel Corporation
Priyanka Dobriyal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Extension mechanism and method for assembling overhanging components
Publication number
20050014419
Publication date
Jan 20, 2005
Tom E. Pearson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Soldered heat sink anchor and method of use
Publication number
20040207076
Publication date
Oct 21, 2004
George Arrigotti
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Heat-shrinkable retainer for PCB double-sided assembly
Publication number
20040209508
Publication date
Oct 21, 2004
Arjang Fartash
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Retainer for circuit board assembly and method for using the same
Publication number
20040011557
Publication date
Jan 22, 2004
Christopher D. Combs
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Interposer to couple a microelectronic device package to a circuit...
Publication number
20040003496
Publication date
Jan 8, 2004
Intel Corporation
Thomas E. Pearson
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
RETAINER FOR CIRCUIT BOARD ASSEMBLY AND METHOD FOR USING THE SAME
Publication number
20030231481
Publication date
Dec 18, 2003
Christopher Combs
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Zero insertion force heat-activated retention pin
Publication number
20030216066
Publication date
Nov 20, 2003
George Arrigotti
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Interposer to couple a microelectronic device package to a circuit...
Publication number
20030156396
Publication date
Aug 21, 2003
Thomas E. Pearson
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Zero mounting force solder-free connector/component and method
Publication number
20030124885
Publication date
Jul 3, 2003
Christopher D. Combs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Epoxy washer for retention of inverted SMT components
Publication number
20030111259
Publication date
Jun 19, 2003
Tom E. Pearson
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Heat-shrinkable retainer for PCB double-sided assembly
Publication number
20030111260
Publication date
Jun 19, 2003
Arjang Fartash
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Epoxy washer for retention of inverted SMT components
Publication number
20030111258
Publication date
Jun 19, 2003
Tom E. Pearson
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Method and structure for identifying lead-free solder
Publication number
20030062192
Publication date
Apr 3, 2003
Tom E. Pearson
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
Soldered heat sink anchor and method of use
Publication number
20030062195
Publication date
Apr 3, 2003
George Arrigotti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Extension mechanism and method for assembling overhanging components
Publication number
20030061709
Publication date
Apr 3, 2003
Tom E. Pearson
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
Methods and electronic board products utilizing endothermic materia...
Publication number
20030057265
Publication date
Mar 27, 2003
Raiyomand F. Aspandiar
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Surface mount component
Publication number
20020148638
Publication date
Oct 17, 2002
Intel Corporation
Arjang Fartash
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD WITH EMBEDDED THERMOCOUPLE JUNCTIONS
Publication number
20020139575
Publication date
Oct 3, 2002
Arjang Fartash
G01 - MEASURING TESTING
Information
Patent Application
Heatsink mounting with shock absorbers
Publication number
20020114137
Publication date
Aug 22, 2002
Tom E. Pearson
H01 - BASIC ELECTRIC ELEMENTS