Raj K. Bansal

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices including stacked dies with interleaved wire...
- Patent number 12,136,607
- Issue date Nov 5, 2024
- Micron Technology, Inc.
- Koichi Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad connection layout
- Patent number 11,876,068
- Issue date Jan 16, 2024
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods including patterns in scribe regions of sem...
- Patent number 11,810,822
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Shigeru Sugioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with hybrid fanouts and associated methods...
- Patent number 11,769,756
- Issue date Sep 26, 2023
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad connection layout
- Patent number 11,502,053
- Issue date Nov 15, 2022
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with hybrid fanouts and associated methods...
- Patent number 11,450,645
- Issue date Sep 20, 2022
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLASMA DICING FOR SEMICONDUCTOR DEVICE FABRICATION
- Publication number 20240371824
- Publication date Nov 7, 2024
- Micron Technology, Inc.
- Yichen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD CONNECTION LAYOUT
- Publication number 20240145425
- Publication date May 2, 2024
- Lodestar Licensing Group LLC
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...
- Publication number 20240088100
- Publication date Mar 14, 2024
- Lodestar Licensing Group LLC
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS
- Publication number 20240072002
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Raj K. Bansal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS A...
- Publication number 20240014083
- Publication date Jan 11, 2024
- Micron Technology, Inc.
- Hem P. Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR FORMING A DEVICE WITH SCRIBE ASYMMETRY
- Publication number 20230326867
- Publication date Oct 12, 2023
- Micron Technology, Inc.
- Anna Maria Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR DICING SEMICONDUCTOR DEVICES
- Publication number 20230290684
- Publication date Sep 14, 2023
- Micron Technology, Inc.
- Wei Chang Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS INCLUDING PATTERNS IN SCRIBE REGIONS OF SEM...
- Publication number 20230090041
- Publication date Mar 23, 2023
- Micron Technology, Inc.
- SHIGERU SUGIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING STACKED DIES WITH INTERLEAVED WIRE...
- Publication number 20230061258
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Koichi Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR CONVEYING SIGN...
- Publication number 20230055425
- Publication date Feb 23, 2023
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD CONNECTION LAYOUT
- Publication number 20230026960
- Publication date Jan 26, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...
- Publication number 20220328456
- Publication date Oct 13, 2022
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...
- Publication number 20220165708
- Publication date May 26, 2022
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD CONNECTION LAYOUT
- Publication number 20220165701
- Publication date May 26, 2022
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS

Raj K. Bansal

Person

Patents Grantslast 30 patents

Semiconductor devices including stacked dies with interleaved wire...

Bond pad connection layout

Apparatuses and methods including patterns in scribe regions of sem...

Semiconductor assemblies with hybrid fanouts and associated methods...

Bond pad connection layout

Semiconductor assemblies with hybrid fanouts and associated methods...

Patents Applicationslast 30 patents

PLASMA DICING FOR SEMICONDUCTOR DEVICE FABRICATION

BOND PAD CONNECTION LAYOUT

SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...

SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS

SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS A...

TECHNIQUES FOR FORMING A DEVICE WITH SCRIBE ASYMMETRY

STRUCTURES AND METHODS FOR DICING SEMICONDUCTOR DEVICES

APPARATUSES AND METHODS INCLUDING PATTERNS IN SCRIBE REGIONS OF SEM...

SEMICONDUCTOR DEVICES INCLUDING STACKED DIES WITH INTERLEAVED WIRE...

SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR CONVEYING SIGN...

BOND PAD CONNECTION LAYOUT

SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...

SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...

BOND PAD CONNECTION LAYOUT