TREA

Raja-Sheker Bollampally

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  • Farmington Hills, MI, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Flip-chip bonding method
    • Patent number 6,998,293
    • Issue date Feb 14, 2006
    • Visteon Global Technologies, Inc.
    • Achyuta Achari
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Flip-chip bonding method
    • Publication number 20030183951
    • Publication date Oct 2, 2003
    • Achyuta Achari
    • H01 - BASIC ELECTRIC ELEMENTS