Rajan Arora

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Hillsboro, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated wafer bow measurements
- Patent number 11,885,750
- Issue date Jan 30, 2024
- Lam Research Corporation
- Rajan Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for combining optical metrology with mass metro...
- Patent number 10,989,652
- Issue date Apr 27, 2021
- Lam Research Corporation
- Ye Feng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Remote detection of plating on wafer holding apparatus
- Patent number 10,416,092
- Issue date Sep 17, 2019
- Lam Research Corporation
- Rajan Arora
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED WAFER BOW MEASUREMENTS
- Publication number 20240094144
- Publication date Mar 21, 2024
- LAM RESEARCH CORPORATION
- Rajan Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE SPOT SPECTRAL SENSING TO CONTROL SPATIAL SETPOINTS
- Publication number 20220334554
- Publication date Oct 20, 2022
- LAM RESEARCH CORPORATION
- Ye Feng
- G05 - CONTROLLING REGULATING
Information Patent Application
INTEGRATED WAFER BOW MEASUREMENTS
- Publication number 20220074869
- Publication date Mar 10, 2022
- LAM RESEARCH CORPORATION
- Rajan Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COMBINING OPTICAL METROLOGY WITH MASS METRO...
- Publication number 20190072482
- Publication date Mar 7, 2019
- LAM RESEARCH CORPORATION
- Ye Feng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REMOTE DETECTION OF PLATING ON WAFER HOLDING APPARATUS
- Publication number 20170299524
- Publication date Oct 19, 2017
- LAM RESEARCH CORPORATION
- Rajan Arora
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR