Rajasekaran Swaminathan

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Glass core package substrates
- Patent number 12,080,632
- Issue date Sep 3, 2024
- Advanced Micro Devices, Inc.
- Deepak Vasant Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package integration using fanout cavity substrate
- Patent number 11,532,563
- Issue date Dec 20, 2022
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket with integrated flex connector
- Patent number 11,398,692
- Issue date Jul 26, 2022
- Apple Inc.
- Mahesh S. Hardikar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE SIDE TRANSISTORS ON SAME SILICON WAFER
- Publication number 20240038596
- Publication date Feb 1, 2024
- ADVANCED MICRO DEVICES, INC.
- Chandra Sekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTH AND SVLC HYBRID CORE ARCHITECTURE FOR LOWER COST COMPONENT EMBE...
- Publication number 20240006290
- Publication date Jan 4, 2024
- ADVANCED MICRO DEVICES, INC.
- Sriranga Sai Boyapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PACKAGE SUBSTRATES
- Publication number 20230102183
- Publication date Mar 30, 2023
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET WITH INTEGRATED FLEX CONNECTOR
- Publication number 20220102884
- Publication date Mar 31, 2022
- Apple Inc.
- MAHESH S. HARDIKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INTEGRATION USING FANOUT CAVITY SUBSTRATE
- Publication number 20220093522
- Publication date Mar 24, 2022
- Apple Inc.
- Karthik Shanmugam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR