Rajen Dias

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,859,248
- Issue date Jan 2, 2018
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,412,702
- Issue date Aug 9, 2016
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface apparatus, systems, and fabrication methods
- Patent number 7,317,258
- Issue date Jan 8, 2008
- Intel Corporation
- Rajen C. Dias
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Microelectronic device interconnects
- Patent number 7,314,817
- Issue date Jan 1, 2008
- Intel Corporation
- Rajen Dias
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic device interconnects
- Patent number 7,078,822
- Issue date Jul 18, 2006
- Intel Corporation
- Rajen Dias
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backside metallization on sides of microelectronic dice for effecti...
- Patent number 7,064,014
- Issue date Jun 20, 2006
- Intel Corporation
- Rajen Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface apparatus, systems, and fabrication methods
- Patent number 7,042,729
- Issue date May 9, 2006
- Intel Corporation
- Rajen C. Dias
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Backside metallization on microelectronic dice having beveled sides...
- Patent number 6,955,947
- Issue date Oct 18, 2005
- Intel Corporation
- Rajen Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip underfill process
- Patent number 6,861,285
- Issue date Mar 1, 2005
- Intel Corporation
- Rajen C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip device with multi-layered underfill having graded coeffic...
- Patent number 6,815,831
- Issue date Nov 9, 2004
- Intel Corporation
- Rajen C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metallization on sides of microelectronic dice for effecti...
- Patent number 6,812,548
- Issue date Nov 2, 2004
- Intel Corporation
- Rajen Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metallization on microelectronic dice having beveled sides...
- Patent number 6,790,709
- Issue date Sep 14, 2004
- Intel Corporation
- Rajen Dias
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20160307869
- Publication date Oct 20, 2016
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20140264951
- Publication date Sep 18, 2014
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Variable depth microchannels
- Publication number 20080073061
- Publication date Mar 27, 2008
- Rajen Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE APPARATUS, SYSTEMS, AND FABRICATION METHODS
- Publication number 20080005886
- Publication date Jan 10, 2008
- Intel Corporation
- Rajen C. Dias
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Thermal interface apparatus, systems, and fabrication methods
- Publication number 20060146501
- Publication date Jul 6, 2006
- Intel Corporation
- Rajen C. Dias
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Microelectronic device interconnects
- Publication number 20050208280
- Publication date Sep 22, 2005
- Rajen Dias
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Backside metallization on microelectronic dice having beveled sides...
- Publication number 20050040498
- Publication date Feb 24, 2005
- Rajen Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly having a die with rounded corner edge portions...
- Publication number 20050017371
- Publication date Jan 27, 2005
- Zhiyong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside metallization on sides of microelectronic dice for effecti...
- Publication number 20050012205
- Publication date Jan 20, 2005
- Rajen Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interface Apparatus, Systems, and Fabrication methods
- Publication number 20040264138
- Publication date Dec 30, 2004
- Intel Corporation
- Rajen C. Dias
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Microelectronic device interconnects
- Publication number 20030234277
- Publication date Dec 25, 2003
- Rajen Dias
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip chip underfill process
- Publication number 20030203536
- Publication date Oct 30, 2003
- Rajen C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip underfill process
- Publication number 20030109080
- Publication date Jun 12, 2003
- Rajen C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside metallization on microelectronic dice having beveled sides...
- Publication number 20030104679
- Publication date Jun 5, 2003
- Rajen Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside metallization on sides of microelectronic dice for effecti...
- Publication number 20030102526
- Publication date Jun 5, 2003
- Rajen Dias
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Laser die backside film removal for integrated circuit (IC) packaging

Laser die backside film removal for integrated circuit (IC) packaging

Thermal interface apparatus, systems, and fabrication methods

Microelectronic device interconnects

Microelectronic device interconnects

Backside metallization on sides of microelectronic dice for effecti...

Thermal interface apparatus, systems, and fabrication methods

Backside metallization on microelectronic dice having beveled sides...

Flip chip underfill process

Flip-chip device with multi-layered underfill having graded coeffic...

Backside metallization on sides of microelectronic dice for effecti...

Backside metallization on microelectronic dice having beveled sides...

Patents Applicationslast 30 patents

LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

Variable depth microchannels

THERMAL INTERFACE APPARATUS, SYSTEMS, AND FABRICATION METHODS

Thermal interface apparatus, systems, and fabrication methods

Microelectronic device interconnects

Backside metallization on microelectronic dice having beveled sides...

Electronic assembly having a die with rounded corner edge portions...

Backside metallization on sides of microelectronic dice for effecti...

Thermal Interface Apparatus, Systems, and Fabrication methods

Microelectronic device interconnects

Flip chip underfill process

Flip chip underfill process

Backside metallization on microelectronic dice having beveled sides...

Backside metallization on sides of microelectronic dice for effecti...